Geometry and stress effects in scaled integrated circuit isolation technologies

Responsibility: by Peter Smeys.
Imprint: 1996.
Physical description: xxi, 160 leaves, bound.

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Author/Creator: Smeys, Peter.
Contributor: Stanford University. Department of Electrical Engineering

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Publication date: 1996
Note: Submitted to the Department of Electrical Engineering.; Copyright by the author.
Note: Thesis (Ph. D.)--Stanford University, 1996.

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