Smart substrates [electronic resource] : Making multi-chip modules smarter

Imprint: Washington, D.C. : United States. Dept. of Energy. ; Oak Ridge, Tenn. : distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy, 1995
Physical description: 1 online resource (46 p. ) : digital, PDF file.

Online

Contributor: Sandia National Laboratories. Researcher; United States. Dept. of Energy. Sponsor; United States. Dept. of Energy. Office of Scientific and Technical Information. Distributor; Treece, R.K. Author; Wunsch, T.F. Author

Summary: A novel multi-chip module (MCM) design and manufacturing methodology which utilizes active CMOS circuits in what is normally a passive substrate realizes the `smart substrate` for use in highly testable, high reliability MCMS. The active devices are used to test the bare substrate, diagnose assembly errors or integrated circuit (IC) failures that require rework, and improve the testability of the final MCM assembly. A static random access memory (SRAM) MCM has been designed and fabricated in Sandia Microelectronics Development Laboratory in order to demonstrate the technical feasibility of this concept and to examine design and manufacturing issues which will ultimately determine the economic viability of this approach. The smart substrate memory MCM represents a first in MCM packaging. At the time the first modules were fabricated, no other company or MCM vendor had incorporated active devices in the substrate to improve manufacturability and testability, and thereby improve MCM reliability and reduce cost.

Subjects: Substrates.; Integrated Circuits.; Design.; Testing.; Artificial Intelligence.; Silicon.; Engineering Not Included In Other Categories.

Publication date: 1995
Note: Published through SciTech Connect.; 05/01/1995.; "sand--95-0861"; "DE95015770"; Treece, R.K.; Wunsch, T.F.
Funding information: AC04-94AL85000