Methods and systems for rapid prototyping of high density circuits [electronic resource].

Imprint
Washington, D.C. : United States. Dept. of Energy ; Oak Ridge, Tenn. : distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy, 2008
Physical description
1 online resource.

Online

Available online

Description

Contents/Summary

Summary
A preferred embodiment provides, for example, a system and method of integrating fluid media dispensing technology such as direct-write (DW) technologies with rapid prototyping (RP) technologies such as stereolithography (SL) to provide increased micro-fabrication and micro-stereolithography. A preferred embodiment of the present invention also provides, for example, a system and method for Rapid Prototyping High Density Circuit (RPHDC) manufacturing of solderless connectors and pilot devices with terminal geometries that are compatible with DW mechanisms and reduce contact resistance where the electrical system is encapsulated within structural members and manual electrical connections are eliminated in favor of automated DW traces. A preferred embodiment further provides, for example, a method of rapid prototyping comprising: fabricating a part layer using stereolithography and depositing thermally curable media onto the part layer using a fluid dispensing apparatus.

Bibliographic information

Publication date
2008
Note
Published through SciTech Connect.
09/02/2008.
"7,419,630"
"US patent application 10/907,979"
Davis, Donald W.; Gallegos, Phillip L.; Wicker, Ryan B.; Palmer, Jeremy A.; Medina, Francisco R.; Chavez, Bart D.
Funding information
AC04-94AL85000
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