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1. Low-temperature multichip-to-wafer 3D integration based on via-last TSV with OER-TEOS-CVD and microbump bonding without solder extrusion [2020]

  • Kumahara, Kousei, Liang, Rui, Lee, Sungho, Miwa, Yuki, Murugesan, Mariappan, Kino, Hisashi, Fukushima, Takafumi, and Tanaka, Tetsu
  • 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :1199-1204 Jun, 2020

2. RDL-first Flexible FOWLP Technology with Dielets Embedded in Hydrogel [2020]

  • Takahashi, Noriyuki, Susumago, Yuki, Lee, Sungho, Miwa, Yuki, Kino, Hisashi, Tanaka, Tetsu, and Fukushima, Takafumi
  • 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :811-816 Jun, 2020

3. Impact of Electroless-Ni Seed Layer on Cu-Bottom-up Electroplating in High Aspect Ratio (>10) TSVs for 3D-IC Packaging Applications [2020]

  • Mariappan, Murugesan, Koyanagi, Mitsumasa, and Fukushima, Takafumi
  • 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :1736-1741 Jun, 2020

4. Tight-Pitch Au-Sn Interconnections for 3D-ICs Integration and Packaging Applications [2020]

  • Mariappan, Murugesan, Koyanagi, Mitsumasa, and Fukushima, Takafumi
  • 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :1448-1452 Jun, 2020

5. 7-μm-thick NCF technology with low-height solder microbump bonding for 3D integration [2020]

  • Miwa, Yuki, Kumahara, Kousei, Lee, Sungho, Liang, Rui, Kino, Hisashi, Fukushima, Takafumi, and Tanaka, Tetsu
  • 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :1453-1458 Jun, 2020

6. Multilithic 3D and Heterogeneous Integration Using Capillary Self-Assembly [2020]

  • Fukushima, Takafumi
  • 2020 4th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) Electron Devices Technology & Manufacturing Conference (EDTM), 2020 4th IEEE. :1-4 Apr, 2020

7. Development of Non-Volatile Tunnel-FET Memory as a Synaptic Device for Low-Power Spiking Neural Networks [2020]

  • Kino, Hisashi, Fukushima, Takafumi, and Tanaka, Tetsu
  • 2020 4th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) Electron Devices Technology & Manufacturing Conference (EDTM), 2020 4th IEEE. :1-3 Apr, 2020

8. Development of Retinal Prosthesis Module for Fully Implantable Retinal Prosthesis [2010]

  • Lee, Kang-Wook, Kaiho, Yoshiyuki, Fukushima, Takafumi, Tanaka, Tetsu, and Koyanagi, Mitsumasa
  • Journal of biomedical engineering research : the official journal of the Korean Society of Medical & Biological Engineering. 2010 31(4):292-301

9. 완전삽입형 인공망막 구현을 위한 인공망막모듈 개발 [2010]

  • 이강욱, 카이호 요시유키, 후쿠시마 타카후미, 타나까 테츠, 고야나기 미쯔마사, Lee, Kang-Wook, Kaiho, Yoshiyuki, Fukushima, Takafumi, Tanaka, Tetsu, and Koyanagi, Mitsumasa
  • Journal of biomedical engineering research : the official journal of the Korean Society of Medical & Biological Engineering. 2010 31(4):292-301

10. Development of 3D-IC Embedded Flexible Hybrid System [2019]

  • Lee, Sungho, Susumago, Yuki, Qian, Zhengyang, Takahashi, Noriyuki, Kino, Hisashi, Tanaka, Tetsu, and Fukushima, Takafumi
  • 2019 International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2019 International. :1-4 Oct, 2019

11. Development of a CDS Circuit for 3-D Stacked Neural Network Chip using CMOS Analog Signal Processing [2019]

  • Kiyoyama, Koji, Zhengy, Qian, Hashimoto, Hiroyuki, Kino, Hisashi, Fukushima, Takafumi, and Tanaka, Tetsu
  • 2019 International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2019 International. :1-4 Oct, 2019

12. Impacts of Deposition Temperature and Annealing Condition on Ozone-Ethylene Radical Generation-TEOS-CVD SiO2 for Low-Temperature TSV Liner Formation [2019]

  • Liang, Rui, Lee, Sungho, Miwa, Yuki, Kumahara, Kousei, Mariappan, Murugesan, Kino, Hisashi, Fukushima, Takafumi, and Tanaka, Tetsu
  • 2019 International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2019 International. :1-4 Oct, 2019

13. Investigation of the Underfill with Negative-Thermal-Expansion Material to Suppress Mechanical Stress in 3D Integration System [2019]

  • Kino, Hisashi, Fukushima, Takafumi, and Tanaka, Tetsu
  • 2019 International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2019 International. :1-4 Oct, 2019

14. Growth Optimization of Multi-Layer Graphene for Thermal-TSV Application in 3D-LSI [2019]

  • Mariappan, Murugesan, Koyanagi, Mitsumasa, and Fukushima, Takafumi
  • 2019 International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2019 International. :1-5 Oct, 2019

15. Characterization of Low-Height Solder Microbump Bonding for Fine-Pitch Inter-Chip Connection in 3DICs [2019]

  • Miwa, Yuki, Lee, Sungho, Liang, Rui, Kumahara, Kousei, Kino, Hisashi, Fukushima, Takafumi, and Tanaka, Tetsu
  • 2019 International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2019 International. :1-4 Oct, 2019

16. Fabrication and Morphological Characterization of Nano-Scale Interconnects for 3D-Integration [2019]

  • Mariappan, Murugesan, Koyanagi, Mitsumasa, Hashimoto, Hiroyuki, Bea, Ji Chel, and Fukushima, Takafumi
  • 2019 International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2019 International. :1-4 Oct, 2019

17. PPG and SpO2 Recording Circuit with Ambient Light Cancellation for Trans-Nail Pulse-Wave Monitoring System [2019]

  • Yabuki, Ryosuke, Tanaka, Tetsu, Qian, Zhengyang, Lee, Kar Mun, Du, Bang, Satake, Filipe Alves, Fukushima, Tasuku, Kino, Hisashi, Fukushima, Takafumi, and Kiyoyama, Koji
  • 2019 IEEE Biomedical Circuits and Systems Conference (BioCAS) Biomedical Circuits and Systems Conference (BioCAS), 2019 IEEE. :1-4 Oct, 2019

18. Mechanical and Electrical Characterization of FOWLP-Based Flexible Hybrid Electronics (FHE) for Biomedical Sensor Application [2019]

  • Susumago, Yuki, Zhengyang, Qian, Jacquemond, Achille, Takahashi, Noriyuki, Kino, Hisashi, Tanaka, Tetsu, and Fukushima, Takafumi
  • 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :264-269 May, 2019

19. Fully-Filled, Highly-Reliable Fine-Pitch Interposers with TSV Aspect Ratio >10 for Future 3D-LSI/IC Packaging [2019]

  • Murugesan, Murugesan, Fukushima, Takafumi, Mori, Kiyoharu, Nakamura, Ai, Lee, Yisang, Motoyoshi, Makoto, Bea, J.C, Watariguchi, Shigeru, and Koyanagi, Mitsumasa
  • 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :1047-1051 May, 2019

20. Noise Propagation through TSV in Mixed-Signal 3D-IC and Investigation of Liner Interface with Multi-Well Structured TSV [2019]

  • Kino, Hisashi, Fukushima, Takafumi, and Tanaka, Tetsu
  • 2019 Electron Devices Technology and Manufacturing Conference (EDTM) Electron Devices Technology and Manufacturing Conference (EDTM), 2019. :222-224 Mar, 2019

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