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Metallurgy, welding, Métallurgie, soudage, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Metaux. Metallurgie, Metals. Metallurgy, Transformation de matériaux métalliques, Production techniques, Traitements de surface, Surface treatment, Autres traitements de surface, Other surface treatments, Canalisation eau potable, Drinking water pipe, Canalización agua potable, Canalisation eau, Water pipe, Conducto agua, Composé non soluble, Insoluble compound, Compuesto no soluble, Eau potable, Drinking water, Agua potable, Electrolyse, Electrolysis, Electrólisis, Elektrolyse, Etude expérimentale, Experimental study, Estudio experimental, Experimentelle Untersuchung, Plomb carbonate, Lead carbonate, Plomo carbonato, Bleicarbonat, Plomb composé, Lead compound, Plomo compuesto, Bleiverbindung, Plomb hydroxyde, Lead hydroxide, Plomo hidróxido, Bleihydroxid, Plomb oxyde, Lead oxide, Plomo óxido, Bleioxid, Plomb, Lead, Plomo, Blei, Propriété électrochimique, Electrochemical properties, Propiedad electroquímica, Elektrochemische Eigenschaft, Traitement surface, Surface treatment, Tratamiento superficie, Oberflaechenbehandlung, Tube métallique, Metal tube, and Tubo metálico

Lead has serious influences on the human body, and lead release from water supply lead pipe into tap water becomes one of the serious problems. The regulations for lead concentration in tap water have gradually become stricter, and will likely be even more stringent in the future. As one of the methods for dealing with the problem of lead water supply pipes prudently, the authors took notice of the electrochemical surface reforming method, and the modification of the lead surface was tried using the repetition technique of the anode-cathode alternate potential sweep. A phase-mixed modified layer, which consists of lead carbonate, lead hydroxide, lead monoxide and lead dioxide, was formed by electrolysis using alkaline electrolyte including carbonate ions. With this modified surface layer, it was possible to suppress the elution amount of lead to about 25% of that of untreated lead.

Metallurgy, welding, Métallurgie, soudage, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Electronique, Electronics, Electronique des semiconducteurs. Microélectronique. Optoélectronique. Dispositifs à l'état solide, Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices, Fabrication microélectronique (technologie des matériaux et des surfaces), Microelectronic fabrication (materials and surfaces technology), Condensateur, Capacitor, Condensador, Etude expérimentale, Experimental study, Estudio experimental, Fabrication microélectronique, Microelectronic fabrication, Fabricación microeléctrica, Microscopie électronique balayage, Scanning electron microscopy, Microscopía electrónica barrido, Microélectronique, Microelectronics, Microelectrónica, Nanotechnologie, Nanotechnology, Nanotecnología, Packaging électronique, Electronic packaging, Packaging electrónico, Placage, Plating, Enchapado, Traitement surface, Surface treatment, Tratamiento superficie, and Application

Metallurgy, welding, Métallurgie, soudage, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Metaux. Metallurgie, Metals. Metallurgy, Transformation de matériaux métalliques, Production techniques, Traitements de surface, Surface treatment, Dépôt de métaux et d'alliages, Metallic coatings, Acier, Steel, Acero, Adhérence, Adhesion, Adherencia, Adhaesion, Bain dépôt, Plating bath, Baño depósito, Dépôt conversion, Conversion coating, Depósito conversión, Konversionsbeschichten, Dépôt métal, Metal deposition, Deposición metal, Metallbeschichten, Dépôt électrolytique, Electrodeposition, Depósito electrolítico, Elektroplattieren, Etude expérimentale, Experimental study, Estudio experimental, Experimentelle Untersuchung, Microscopie électronique balayage, Scanning electron microscopy, Microscopía electrónica barrido, Rasterelektronenmikroskopie, Microstructure, Microestructura, Mikrogefuege, Résistance corrosion, Corrosion resistance, Resistencia corrosión, Korrosionsbestaendigkeit, Silice, Silica, Sílice, Traitement surface, Surface treatment, Tratamiento superficie, Oberflaechenbehandlung, Zingage, Zinc coating, Galvanización con cinc, and Verzinken

Colloidal silica films were produced on zinc-electroplated steel using a new chemical conversion treatment, which provides an alternative to chromate conversion coating. The treatment solution consisted of colloidal silica, titanium sulfate, cobalt sulfate and nitrate ions at 298K, pH 2. The corrosion resistance of the film coated specimens was estimated by impedance measurement in a sodium chloride solution for 8 days. The effects of colloidal silica concentration, treatment time and additive ions on corrosion resistance and adhesion of the film were investigated. The addition of titanium sulfate to the colloidal silica solution changed the surface potential of silica particles from negative to positive and improved the film characteristics. The addition of cobalt sulfate enhanced the adhesion between the zinc on the steel and the silica film. The film was not formed without nitride ions. Chemical conversion for 90s in a solution containing 200 mM colloidal silica, 4.2 mM titanium sulfate, 1.8 mM cobalt sulfate, 4.2 mM succinic acid and ajusted pH 2 by nitric acid at 298 K showed excellent film characteristics.

Metallurgy, welding, Métallurgie, soudage, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Metaux. Metallurgie, Metals. Metallurgy, Transformation de matériaux métalliques, Production techniques, Traitements de surface, Surface treatment, Dépôt de métaux et d'alliages, Metallic coatings, Couche mince, Thin film, Capa fina, Duennschicht, Cuivre, Copper, Cobre, Kupfer, Dépôt métal, Metal deposition, Deposición metal, Metallbeschichten, Electrolyte, Electrolito, Elektrolyt, Etude expérimentale, Experimental study, Estudio experimental, Experimentelle Untersuchung, Méthode électrochimique, Electrochemical method, Método electroquímico, Placage, Plating, Enchapado, Plattieren, Polarisation anodique, Anodic polarization, Polarización anódica, Anodische Polarisation, Traitement surface, Surface treatment, Tratamiento superficie, and Oberflaechenbehandlung

The electroplating of copper has been done by using a thin film of gel electrolyte. The electrochemical behavior of the copper plating cell was investigated by electrochemical methods involving an impedance method. The current efficiencies of both copper deposition and copper counter electrode dissolution did not depend on the thickness of the gel electrolyte. It was confirmed that the copper plating could be accomplished using a gel electrolyte of 1 mm thickness. The cell voltage increases due to solution resistance with the increase of gel electrolyte thickness. Therefore, decrease of electrical power requirement and minimization of the plating cell can be expected by electroplating using a thin gel electrolyte.

Metallurgy, welding, Métallurgie, soudage, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Metaux. Metallurgie, Metals. Metallurgy, Transformation de matériaux métalliques, Production techniques, Traitements de surface, Surface treatment, Dépôt de métaux et d'alliages, Metallic coatings, Corrosion, Action des agents de corrosion, Corrosion environments, Acier inoxydable 304, Stainless steel-304, Acier inoxydable austénitique, Austenitic stainless steel, Acero inoxidable austenítico, Austenitischer nichtrostender Stahl, Acier, Steel, Acero, Aluminisation, Aluminizing, Aluminizacion, Aluminieren, Aluminium, Aluminio, Corrosion à chaud, Hot corrosion, Corrosión en caliente, Heisskorrosion, Diffraction RX, X ray diffraction, Difracción RX, Roentgenbeugung, Dépôt métal, Metal deposition, Deposición metal, Metallbeschichten, Dépôt électrolytique, Electrodeposition, Depósito electrolítico, Elektroplattieren, Electrolyse, Electrolysis, Electrólisis, Elektrolyse, Etude expérimentale, Experimental study, Estudio experimental, Experimentelle Untersuchung, Microscopie électronique balayage, Scanning electron microscopy, Microscopía electrónica barrido, Rasterelektronenmikroskopie, Oxydation, Oxidation, Oxidación, Résistance oxydation, Oxidation stability, Resistencia a la oxidación, Sel fondu, Molten salt, Sal fundida, Salzschmelze, Traitement surface, Surface treatment, Tratamiento superficie, Oberflaechenbehandlung, and Acier Cr19Ni10

An Al deposit layer on a SUS 304 stainless steel substrate was formed by electrodepositing Al and alloying it with SUS 304 steel in molten salt. Electrolysis of Al was conducted using a potentiostatic polarization method in an equimolar NaCl-KCl melt containing 3.5 mol%AlF3 at 1023 K. Deposits formed at -1.3∼-1.6 V [vs. Ag/Ag+(0.1)] built up a homogeneous layer, which was adhesive to the SUS 304 substrate. These deposits consisted mainly of Fe aluminides. The thickness of the deposit layer and the aluminum concentration in the deposit layer increased with a decrease in polarization potential. The SUS 304 steel covered by the electrodeposited layer was more resistant than bare SUS 304 steel to high temperature oxidation.

Metallurgy, welding, Métallurgie, soudage, Sciences exactes et technologie, Exact sciences and technology, Physique, Physics, Domaines interdisciplinaires: science des materiaux; rheologie, Cross-disciplinary physics: materials science; rheology, Science des matériaux, Materials science, Méthodes de dépôt de films et de revêtements; croissance de films et épitaxie, Methods of deposition of films and coatings; film growth and epitaxy, Dépôt chimique en phase vapeur (incluant le cvd activé par plasma, mocvd, etc.), Chemical vapor deposition (including plasma-enhanced cvd, mocvd, etc.), Chemical vapor deposition (including plasma-enhanced CVD, MOCVD, etc.), Couche mince, Thin films, Croissance cristalline, Crystal growth, Diamant synthétique, Synthetic diamond, Diamante sintético, Dépôt chimique phase vapeur, CVD, Etude expérimentale, Experimental study, Microscopie électronique balayage, Scanning electron microscopy, Pulvérisation, Sprays, Spectrométrie Raman, Raman spectroscopy, Diamant, Filament, Synthèse, and Traitement surface

Flattened diamond crystals can be synthesized on polycrystal gold plate by hot-filament chemical vapor deposition (HFCVD) at atmospheric pressure. The ratio of the size of the top face and the height is 20 : 1 or more. Spraying the reaction gas onto the substrate is effective for synthesis of flattened diamond crystal. By spraying the reaction gas onto the substrate, sub-micron crystals on the substrate migrate. Then, they collide with each other, and twins are formed. The preferential growth of the side face that has the re-entrant corner occurs. Finally, flattened diamond crystals are formed. Moreover, the quality of all the diamond crystals including flattened diamonds can be improved by spraying the reaction gas. The probability of synthesis of flattened diamond crystal is 50%on HFCVD when spraying the reaction gas at 13kPa.

Metallurgy, welding, Métallurgie, soudage, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Metaux. Metallurgie, Metals. Metallurgy, Transformation de matériaux métalliques, Production techniques, Traitements de surface, Surface treatment, Dépôt de métaux et d'alliages, Metallic coatings, Corrosion, Action des agents de corrosion, Corrosion environments, Alliage base magnésium, Magnesium base alloys, Corrosion acide, Acid corrosion, Corrosión ácido, Saeurekorrosion, Corrosion sel, Salt corrosion, Corrosión sal, Salzkorrosion, Couche oxyde, Oxide layer, Capa óxido, Oxidschicht, Dépôt conversion, Conversion coating, Depósito conversión, Konversionsbeschichten, Etude expérimentale, Experimental study, Estudio experimental, Experimentelle Untersuchung, Microscopie électronique balayage, Scanning electron microscopy, Microscopía electrónica barrido, Rasterelektronenmikroskopie, Oxyde anodique, Anodic oxide, Oxido anódico, Procédé sol gel, Sol gel process, Procedimiento sol gel, Protection corrosion, Corrosion protection, Protección corrosión, Korrosionsschutz, Revêtement, Coatings, Revestimiento, Ueberzug, Résistance corrosion, Corrosion resistance, Resistencia corrosión, Korrosionsbestaendigkeit, Silane copolymère, Silane copolymer, Silano copolímero, Traitement surface, Surface treatment, Tratamiento superficie, Oberflaechenbehandlung, Corrosion, and Revêtement métallique

To improve the corrosion resistance to salt and acidic attack of magnesium alloy, composite films consisting of a chemical conversion film or an anodic oxide film and a coating layer deposited thereon were prepared by the sol-gel process using tetaethoxysilane as a metal alkoxide. These composite films prepared by repearting three or five dip-coatings indicated an excellent corrosion resistance to salt attack. Furthermore, the acidic corrosion resistance of composite film formed on anodic oxide film was examined using an electromotive force measurement test. In comparisons between the composite films prepared by repeating three dip-coatings and an anodic oxide film of magnesium alloy, the acidic corrosion resistances of these films to various acids increased by a factor of 12 to 33 on the anodic oxide film in the thickness of 7μm and a factor of 3.4 to 7.6 for thickness of 15μm. These improvement of corrosion resistance are considered to be caused by the production of some reaction products in the path of a salt solution or an acid that is penetrating into the composite film.

Metallurgy, welding, Métallurgie, soudage, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Metaux. Metallurgie, Metals. Metallurgy, Transformation de matériaux métalliques, Production techniques, Traitements de surface, Surface treatment, Nettoyage. Dégraissage. Décapage, Cleaning. Degreasing. Pickling, Alliage base aluminium, Aluminium base alloys, Aluminium chlorure, Aluminium chloride, Aluminio cloruro, Aluminiumchlorid, Attaque chimique, Chemical etching, Ataque químico, Chemisches Aetzen, Chlorique acide, Chloric acid, Clórico ácido, Décapage, Pickling, Decapado, Beizen, Etude expérimentale, Experimental study, Estudio experimental, Experimentelle Untersuchung, Microscopie électronique balayage, Scanning electron microscopy, Microscopía electrónica barrido, Rasterelektronenmikroskopie, Sodium chlorure, Sodium chloride, Sodio cloruro, Natriumchlorid, Traitement surface, Surface treatment, Tratamiento superficie, and Oberflaechenbehandlung

Observation of tunnels formed on D. C. etched {100} highly ordered aluminum and analysis of the tunnel shape near the tunnel mouth were performed by using the oxide replica method. The tunnel shape near the tunnel mouth was measured as a function of the tunnel depth (li) for the tunnels obtained by the D. C. etching in HCl, NaCl, AlCl3, HCl+ AlCl3, NaCl+AlCl3, H2SO4+AlCl3, and HCl+NaCl aqueous solutions. The tunnel width (Wi) tapered exponentially with /i, i. e., log (W1/W0) = a.li, where W0 is the tunnel width at the tunnel mouth, in all the solutions examined in this study. In the solutions containing H- ions, the tunnel width increased with the increase in the tunnel depth near the tunnel mouth at depths of 4 to 5μm from the aluminum surface, followed by a decrease of the tunnel width at depths of 5μm or more. The degree of expansion of the tunnel width increased with increasing H+ concentration. This indicated that the increase of the tunnel width with an increasing tunnel depth near the tunnel mouth was closely related to the presence of H+ ions. Corrosion (Al → Al3+ + 3 e-, 2 H+ + 2 e-→ H2) of aluminum near the tunnel mouth, in which H+ took part, was suggested as the origin of the tunnel width expansion near the tunnel mouth. In HCl+AlCl3, NaCl + AlCl3, and H2SO4+AlCl3 aqueous solutions, the degree of expansion of tunnel width decreased rapidly compared to the HCl and AlCl3 solutions. Al3+, Cl-, and H+ ion played an important part in determination of the tunnel shape near the tunnel mouth. The rapid decrease of the degree of the tunnel width expansion near the tunnel mouth was considered to be caused by the increase in the concentration of Al3+, Cl-, and He ion in the tunnel, followed by the hindrance of the electrolytic dissolution of Al.

Metallurgy, welding, Métallurgie, soudage, Sciences exactes et technologie, Exact sciences and technology, Physique, Physics, Domaines interdisciplinaires: science des materiaux; rheologie, Cross-disciplinary physics: materials science; rheology, Science des matériaux, Materials science, Méthodes de dépôt de films et de revêtements; croissance de films et épitaxie, Methods of deposition of films and coatings; film growth and epitaxy, Electrodépôt, Electrodeposition, electroplating, Sciences appliquees, Applied sciences, Metaux. Metallurgie, Metals. Metallurgy, Angle contact, Contact angle, Composé hydrophile, Hydrophilic compound, Compuesto hidrofilo, Couche mince, Thin films, Dépôt électrolytique, Electrodeposition, Etude expérimentale, Experimental study, Microscopie électronique balayage, Scanning electron microscopy, Nickel, Placage, Plating, Revêtement, Coatings, Titane oxyde, Titanium oxides, Zinc, Matériau composite, Revêtement composite, and Traitement surface

Hydrophilic Ni-Zn alloy films were prepared by electrolytic composite-plating with Titanium oxide (TiO2) fine particles. As the amount of dispersed TiO2 particles in the plating bath increased, the amount of co-deposited TiO2 increased and reached a constant value at 60 g dm-3 of dispersed TiO2: and the surface roughness and weight ratio of Ni atoms to Zn atoms also increased. The Ni-Zn/TiO2 composite-plated film a showed higher contact angle against water droplets than the Ni-Zn plated film for the common measurement, although the TiO2 plate prepared by the Sol-gel method showed a lower value than the other plated films. Two other measurements of contact angle employed suggested that a hydrated layer was formed on the TiO2particle surface and the adherent water on the layer spread over the composite-plated film surface. Then this spread water induced spreading area of the hydrated layer and consequently improved the wettability of the film surface. It was also implied that wettability of the film surface improved with the increase of co-deposited TiO2 particles and the decrease of roughness with grinding. A composite-plated film by 4 wt% of co-deposited TiO2 particles gave a 25 degree contact angle. The Ni-Zn/TiO2 composite-plated film was found to have corrosion resistance equal to Ni-Zn plated films.

Metallurgy, welding, Métallurgie, soudage, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Metaux. Metallurgie, Metals. Metallurgy, Transformation de matériaux métalliques, Production techniques, Traitements de surface, Surface treatment, Autres traitements de surface, Other surface treatments, Agent surface, Surfactant, Agente superficie, Oberflaechenaktiver Stoff, Etude expérimentale, Experimental study, Estudio experimental, Experimentelle Untersuchung, Huile, Oil, Aceite, Microcapsule, Microcápsula, Microscopie électronique balayage, Scanning electron microscopy, Microscopía electrónica barrido, Rasterelektronenmikroskopie, Monomère, Monomer, Monómero, Nickel, Niquel, Revêtement composite, Composite coating, Revestimiento compuesto, Revêtement, Coatings, Revestimiento, Ueberzug, Traitement surface, Surface treatment, Tratamiento superficie, and Oberflaechenbehandlung

Nickel and oil-containing microcapsule composite coatings were fabricated. The oil-containing microcapsules were synthesized by the interfacial polymerization of the oil-soluble and water-soluble monomers. The influences of the intension substance and the surfactant on the size distribution were discussed. The surface and the cross-section of the oil-containing microcapsules composite coatings were observed by scanning electron microscope. From the result of the observation, it was found that microcapsules were involved in the nickel matrix. Furthermore, a new composite plating method, in which the 100% of the microcapsules in the electrolyte solution were incorporated into the nickel matrix, was developed. In addition, the stability of microcapsules in the nickel matrix was investigated. It was confirmed that microcapsules in the nickel matrix were stable.

Metallurgy, welding, Métallurgie, soudage, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Metaux. Metallurgie, Metals. Metallurgy, Transformation de matériaux métalliques, Production techniques, Usinage, Cutting, Autres procédés d'usinage, Other machining methods, Alliage base nickel, Nickel base alloys, Alliage binaire, Binary alloy, Aleación binaria, Alliage mémoire forme, Shape memory alloy, Aleación memoria forma, Formgedaechtnislegierung, Dispositif expérimental, Experimental device, Dispositivo experimental, Electrolyte, Electrolito, Elektrolyt, Etude expérimentale, Experimental study, Estudio experimental, Experimentelle Untersuchung, Gravure électrochimique, Electrochemical etching, Grabado electroquímico, Microusinage, Micromachining, Micromaquinado, Méthanol, Methanol, Metanol, Sel minéral, Mineral salt, Sal inorgánica, Sulfurique acide, Sulfuric acid, Sulfúrico ácido, Schwefelsaeure, Titane alliage, Titanium alloy, Titanio aleación, Titanlegierung, Traitement surface, Surface treatment, Tratamiento superficie, and Oberflaechenbehandlung

For the purpose of micromachining application, we have studied basic characteristics of electrochemical etching of NiTi Shape Memory Alloy (SMA) in new electrolytes of inorganic salt in alcohol for comparison with conventional H2SO4-methanol solution, especially from the viewpoint of the suppresion of the etching rate. In the case of conventional H2SO4-metanol solution, good etching with planarized etched surface and high etch rate could be carried out, however, the etch factor (etching depth/side etching width) and surface flatness became worse under low etch rate conditions. The electrochemical etching of SMA also could be carried out in new electrolyte solutions using NH4Cl, NaClO4 and LiCl solute. Especially in the case of LiCl-ethanol, good etching properties such as controllable low etch rate of 3.5μm/min, planarized etched surface and high etch factor of 1,5 were realized. Although the etching condition was not in the electrolytic polishing region, the etched surface was planarized because there were no influences of a reaction of passivation, which inhibits the surface planarization. In the case of LiCl-methanol, the etching rate was over 10μm/min, however, planarized etched surface and high etch factor were also realized.

Metallurgy, welding, Métallurgie, soudage, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Electronique, Electronics, Electronique des semiconducteurs. Microélectronique. Optoélectronique. Dispositifs à l'état solide, Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices, Fabrication microélectronique (technologie des matériaux et des surfaces), Microelectronic fabrication (materials and surfaces technology), Aluminium, Aluminio, Anodisation, Anodizing, Anodización, Carte électronique, Printed circuit board, Tarjeta electronica, Couche oxyde, Oxide layer, Capa óxido, Dépôt électrolytique, Electrodeposition, Depósito electrolítico, Etude expérimentale, Experimental study, Estudio experimental, Fabrication microélectronique, Microelectronic fabrication, Fabricación microeléctrica, Irradiation laser, Laser irradiation, Irradiación láser, Microscopie électronique balayage, Scanning electron microscopy, Microscopía electrónica barrido, Traitement surface, Surface treatment, Tratamiento superficie, Application, Circuit imprimé, Corrosion, Electronique, Epaisseur couche, Laser, and Oxydation

An aluminum specimen covered with porous type oxide films with 3 to 54 μm thickness was irradiated by a pulsed Nd-YAG laser through a convex lens with 20mm focal length in a solution to examine the mode of oxide film removal by laser irradiation. A prototype printed circuit board was fabricated using laser irradiation and Au electroplating. Thin oxide films were removed instantaneously after laser irradiation onset by the laser ablation mechanism. Thick oxide films were destructed initially from the upper part of the oxide films by the thermal shock mechanism, and then by the laser ablation mechanism. Further laser irradiation after the film removal caused the formation of many cracks in the oxide film surrounding the irradiated area. By scanning a laser beam over a specimen covered with oxide films with 9μm thickness. the oxide film was removed uniformly with a 30μm line width. Fine pattern coils of 30 μm wide Au lines were fabricated on the insulating board by consecutive processes of aluminum anodizing. laser irradiation, Au electroplating. resion attaching, and removal of aluminum substrate and oxide film.

Metallurgy, welding, Métallurgie, soudage, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Electronique, Electronics, Matériaux, Materials, Circuit intégré, Integrated circuit, Circuito integrado, Courant photoélectrique, Photoelectric current, Corriente fotoeléctrica, Dépôt physique phase vapeur, Physical vapor deposition, Deposición física fase vapor, Etude expérimentale, Experimental study, Estudio experimental, Fabrication microélectronique, Microelectronic fabrication, Fabricación microeléctrica, Intégration LSI, Large scale integration, Microscopie électronique balayage, Scanning electron microscopy, Microscopía electrónica barrido, Photoélectricité, Photoelectricity, Prétraitement, Pretreatment, Pretratamiento, Traitement surface, Surface treatment, Tratamiento superficie, Zinc oxyde, Zinc oxide, Zinc óxido, and Simulation

Small Al electrodes connected to the pins of a model IC were subjected to zincate pretreatment to simulate the plating process in an LSI manufacturing line. From SEM observation, deposition of Zn and dissolution of Al substrate depended on the potential of Al electrodes under the potentiostatic polarization in the zincate solution. Difference in electric impedance of IC pins affected the immersion potenial of Al electrodes in the zincate solution and thus the amount of Zn deposition. Visible light illumination on the separated p-Si electrode additionally connected to the power supply pin of the IC generated photocurrent. This caused a shift in immersion potential of Al electrodes connected to the other pins of the IC in a noble direction, resulting in suppression of Zn deposition in the zincate pretreatment.

Metallurgy, welding, Métallurgie, soudage, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Metaux. Metallurgie, Metals. Metallurgy, Transformation de matériaux métalliques, Production techniques, Traitements de surface, Surface treatment, Dépôt de métaux et d'alliages, Metallic coatings, Additif, Additive, Aditivo, Zusatzstoff, Chrome, Chromium, Cromo, Chrom, Couche mince, Thin film, Capa fina, Duennschicht, Dépôt électrolytique, Electrodeposition, Depósito electrolítico, Elektroplattieren, Ethane-1,2-diol, Ethylene glycol, 1,2-Etanodiol, Etude expérimentale, Experimental study, Estudio experimental, Experimentelle Untersuchung, Gélatine, Gelatin, Gelatina, Revêtement, Coatings, Revestimiento, Ueberzug, Spectre photoélectron RX, X-ray photoelectron spectra, Zinc, Zink, Polymère, Revêtement métallique, Sulfate, and Traitement surface

Zn-Cr electrodeposition behavior was studied in the sulfate solutions containing acyclic polymer additives such as gelatin and polyethylene glycol (PEG) at 2kA/m2. The electroreduction of Cr ions into metal was promoted by the addition of gelatin as well as PEG to the solution, and the deposits contained Cr in both trivalent and metallic states. The ratio of metallic Cr to total Cr changed depending on the molecular weight and the concentration of gelatin and PEG added to the electrolytic solution. Further, the cathode potential shifted to the less noble direction with increasing molecular weight or concentration of these additives. The ratio of metallic Cr in deposits showed a close relation with the cathode potential, and reached a maximum value at approximately-1.2 V (vs. NHE). At potentials less noble than -1.2V, the deposits contained a considerable amount of trivalent Cr, which was the product of hydrolysis resulting from the accelerated hydrogen evolution by both the decomposition of water and the decrease in overpotential for hydrogen due to increase in Cr content in deposits.

Metallurgy, welding, Métallurgie, soudage, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Metaux. Metallurgie, Metals. Metallurgy, Transformation de matériaux métalliques, Production techniques, Traitements de surface, Surface treatment, Dépôt de métaux et d'alliages, Metallic coatings, Propriétés mécaniques. Rhéologie. Mécanique de la rupture. Tribologie, Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology, Fatigue, Acier haute résistance, High strength steel, Acero alta resistencia, Hochfester Stahl, Amorçage fissure, Crack initiation, Iniciación grieta, Risseinleitung, Etude expérimentale, Experimental study, Estudio experimental, Experimentelle Untersuchung, Fissure fatigue, Fatigue crack, Fisura fatiga, Ermuedungsriss, Revêtement, Coatings, Revestimiento, Ueberzug, Résistance fatigue, Fatigue strength, Resistencia fatiga, Dauerfestigkeit, Résistance propagation fissure, Crack propagation resistance, Resistencia propagación grieta, Traitement surface, Surface treatment, Tratamiento superficie, Oberflaechenbehandlung, Zingage immersion, Hot dip galvanizing, Galvanización con cinc sumergido, Feuerverzinken, Corrosion, Fatigue avec corrosion, Revêtement métallique, and Zinc

Fatigue crack initiation and propagation behaviors under corrosive conditions were examined using high tensile steel specimens treated by Hot-Dipped Zn-5%Al and Zn-55%Al-1.6%Si alloy coating. Corrosion rate of the coating and the fatigue crack initiation in the steel were examined first. Then the sacrifice anticorrosive effect for the fatigue crack propagation was examined. As the result, the following conclusions were obtained. (1) After the coating vanished, the corrosion rate of the base metal was slower than that of the uncoated case. Especially, the Hot-Dipped Zn-55%Al-1.6%Si specimen showed the slowest corrosion rate. (2) The number of cycles necessary to initiate the fatigue crack in the coating vanished specimen is larger than that for the uncoated specimen. (3) When the stress intensity factor falls below 31MPam, the crack propagation rate by the use of Zn-55%Al-1.6% Si anode, becomes slower than that under atmospheric air condition. From the above facts, the Hot-Dipped Zn-55%Al-1.6%Si alloy-coated steel exhibited excellent properties superior to the Zn-5%Al alloy-coated steel with respect to the initiation and propagation of corrosion fatigue crack.

Metallurgy, welding, Métallurgie, soudage, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Metaux. Metallurgie, Metals. Metallurgy, Transformation de matériaux métalliques, Production techniques, Traitements de surface, Surface treatment, Dépôt de métaux et d'alliages, Metallic coatings, Acier, Steel, Acero, Densité courant, Current density, Densidad corriente, Stromdichte, Dépôt électrolytique, Electrodeposition, Depósito electrolítico, Elektroplattieren, Electrolyse, Electrolysis, Electrólisis, Elektrolyse, Etude expérimentale, Experimental study, Estudio experimental, Experimentelle Untersuchung, Traitement surface, Surface treatment, Tratamiento superficie, Oberflaechenbehandlung, Tôle mince, Thin sheet, Chapa fina, Feinblech, and Distribution courant

The gas bubbles are evolved in the horizontal electroplating cell, so that the surface uniformity and other properties of electroplated steel sheet are affected by the current density distribution in the direction of net movement of gases. In the electroplating industry, it is essential to know and control the current density distribution. In this study, in order to clear the behavior of gas evolved in the horizontal electroplating cell, the effects of the liquid velocity and average current density on the current density distribution in the horizontal parallel electrolysis cell were experimentally investigated. Gas holdup in horizontal electrolysis cell increases in the direction of liquid flow. causing a corresponding variation in the ohmic resistance between electrode and electroplated steel sheet. The resulting non-uniformity in current density distribution and the increase in overall resistance in the horizontal electroplating cell are characterized by the modified equation of Tobias equation derived for vertical electrolysis cell. The experimental results of effect of gas evolution on current density distribution in the horizontal electrolysis cell were simulated by the model calculation modified by considering the gas holdup, which is effective for electrolysis evolving large amount of gas bubbles.

Metallurgy, welding, Métallurgie, soudage, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Metaux. Metallurgie, Metals. Metallurgy, Transformation de matériaux métalliques, Production techniques, Traitements de surface, Surface treatment, Dépôt de métaux et d'alliages, Metallic coatings, Caractéristique capacité tension, Voltage capacity curve, Característica capacidad tensión, Couche mince, Thin film, Capa fina, Duennschicht, Dépôt par oxydoréduction, Electroless plating, Depósito por oxidorreducción, Etude expérimentale, Experimental study, Estudio experimental, Experimentelle Untersuchung, Nickel, Niquel, Nickelage, Nickel plating, Niquelado, Vernickeln, Procédé dépôt, Deposition process, Procedimiento revestimiento, Beschichtungsverfahren, Système redox, Redox system, Sistema redox, Titane, Titanium, Titanio, Titan, Traitement surface, Surface treatment, Tratamiento superficie, Oberflaechenbehandlung, Dépôt chimique, Dépôt électrolytique, Développement, and Revêtement métallique

A novel Ni electroless plating method using Ti(III) as a reducer, which was characterized as a zero-emission process, was proposed. In this process, Ti (IV) formed during electroless plating reaction of Ni was electrolytically reduced to recycle Ti(III). This paper mainly deals with the electrolytic reduction behavior of Ti(IV) in a weak alkaline solution determined by cyclic-voltammetry measurement. Both Ti (IV) and Ti (III) are stable in soluble form in the pH range of 7 to 9 under the presence of complexing agents such as trisodium citrate and nitrilotriacetic acid. Cyclic-voltammetry measurements were made for Ni, Ti, Pb and Carbon felt, each was used as a negative electrode, and Carbon felt showed the most superior behavior as a negative electrode. It was demonstrated that electrolytic reduction of Ti (IV) was possible in a weak alkaline solution of pH 7 to 9 in the presence of trisodium citrate and nitrilotriacetic acid, obtaining 65% regeneration efficiency. However, if the Ni(II) ions remained in the plating solution it interfered with current efficiency by preferentially plating Ni on the Carbon felt electrode, evolving hydrogen gas. To avoid such trouble, it was proposed that the concentration of Ti(III) be increased to twice the Ni(II) concentration or that of pH 0 waste solution be applied.

Metallurgy, welding, Métallurgie, soudage, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Metaux. Metallurgie, Metals. Metallurgy, Transformation de matériaux métalliques, Production techniques, Traitements de surface, Surface treatment, Dépôt de métaux et d'alliages, Metallic coatings, Corrosion, Essais de corrosion, Corrosion tests, Dépôt métal, Metal deposition, Deposición metal, Metallbeschichten, Dépôt électrolytique, Electrodeposition, Depósito electrolítico, Elektroplattieren, Etude expérimentale, Experimental study, Estudio experimental, Experimentelle Untersuchung, Gel colloïdal, Colloidal gel, Gel coloidal, Microscopie électronique balayage, Scanning electron microscopy, Microscopía electrónica barrido, Rasterelektronenmikroskopie, Polarisation cathodique, Cathodic polarization, Polarización catódica, Kathodische Polarisation, Propriété électrochimique, Electrochemical properties, Propiedad electroquímica, Elektrochemische Eigenschaft, Traitement surface, Surface treatment, Tratamiento superficie, Oberflaechenbehandlung, and Corrosion électrochimique

The electroplating of copper using a gel electrolyte has been studied. The suitable condition to gelate the high concentration electrolyte solution by gelatin was found. Using the gel electrolyte, it is easy to fix and remove the electrolyte on/from the metal surface. The influences of pH and chloride concentration on copper deposition using gel electrolyte were investigated by the cathodic polarization curves and surface observation. Finally, pattern electroplating using gel electrolyte was performed.