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1. A study of low profile multilayer balun in LTCC substrate [2008]

  • Kouji Wada, Ryuji Murata, Shinpei Oshima, Yukihiro Shimakata, 和田 光司, 大島 心平, 島方 幸広, and 村田 龍司
  • Proceedings of JIEP Annual Meeting. 2008, :81

2. Prototyping Using Synchrotron Radiation Lithography and Its Application Large Area Lithography with Variable Wavelength [2008]

  • Yuichi UTSUMI
  • Journal of The Japan Institute of Electronics Packaging. 2008, 11(7):550

3. Prototyping Using Synchrotron Radiation Lithography and Its Application Application to Optical Waveguide for Liquid Crystal Back Light Unit [2009]

  • Yuichi Utsumi and 内海 裕一
  • エレクトロニクス実装学会誌 / Journal of The Japan Institute of Electronics Packaging. 2009, 12(1):86

4. Miniaturization of a Wideband Filter in an LTCC Substrate for Compact Wireless Modules [2009]

  • Kouji Wada, Ryuji Murata, Shinpei Oshima, Yukihiro Shimakata, 和田 光司, 大島 心平, 島方 幸広, and 村田 龍司
  • エレクトロニクス実装学会誌 / Journal of The Japan Institute of Electronics Packaging. 2009, 12(7):629

5. The Consolidated Simulation Environment for The Cellular Phone Terminals Development [2010]

  • Atsushi Iwabuchi, Fumio Amano, Hideyuki Saso, Kazuya Masu, Masao Yamasawa, Noboru Ishihara, 佐相 秀幸, 天野 文雄, 山澤 昌夫, 岩渕 敦, 益 一哉, and 石原 昇
  • エレクトロニクス実装学会誌 / Journal of The Japan Institute of Electronics Packaging. 2010, 13(2):134

6. A High-Signal-Integrity PCB Trace Composed of Multiple Segments for GHz VLSI Packaging: Its Prototyping and Performance Analysis [2011]

  • Hiroki Shimada, Ikuo Yoshihara, Masami Ishiguro, Moritoshi Yasunaga, and Shohei Akita
  • Transactions of The Japan Institute of Electronics Packaging. 2011, 4(1):44

7. Modelling Challenges towards Virtual Prototyping of SiC based Power Modules [2017]

  • Ulrike Grossner
  • Journal of The Japan Institute of Electronics Packaging. 2017, 20(7):432

8. PCB Depaneling Equipment and PCB Prototyping Equipment [2018]

  • 藤村 迅
  • MES. 2018, :395

9. Probes for Very Small Pitch Bump Arrays Using a High Resolution 3D Printer [2018]

  • Hitoshi Nagata, Liwen Fan, Masato Suzuki, Sachiko Hattori, Seiji Aoyagi, Susumu Sugiyama, Taeko Ando, Tomoyuki Takeda, Tsunemasa Saiki, Yukako Takizawa, 安藤 妙子, 才木 常正, 服部 佐知子, 杉山 進, 樊 利文, 武田 朋之, 永田 一志, 瀧澤 由佳子, 鈴木 昌人, and 青柳 誠司
  • エレクトロニクス実装学会誌 / Journal of The Japan Institute of Electronics Packaging. 2018, 21(6):586

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