Control theory, operational research, Automatique, recherche opérationnelle, Electronics, Electronique, Optics, Optique, Physics, Physique, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Informatique; automatique theorique; systemes, Computer science; control theory; systems, Automatique théorique. Systèmes, Control theory. Systems, Robotique, Robotics, Calculateur embarqué, Boarded computer, Calculador embarque, Capteur mesure, Measurement sensor, Captador medida, Conception assistée, Computer aided design, Concepción asistida, Insertion, Inserción, Prototypage rapide, Rapid prototyping, Prototipificación rápida, Robot mobile, Moving robot, Robot móvil, Robotique, Robotics, Robótica, Système autonome, Autonomous system, Sistema autónomo, Système réparti, Distributed system, Sistema repartido, Système temps réel, Real time system, Sistema tiempo real, Unité contrôle, Control unit, Unidad control, Empaqueteur, Wrapper, and Envolvero

Recent experiences with robots in Iraq have proven that robotic technology is useful to the warfighter, but tools are needed to rapidly respond to evolving missions. This paper details a methodology for generation of software wrappers using JAUS to simplify prototyping and development of robotic systems (distributed, embedded and real-time system software modules). Software wrappers will allow insertion of modules into a visual prototyping environment. The wrappers will intercept module functions and bind them with functions needed to exercise the modules outside of the native environment. Generation of JAUS wrappers will enhance the development environment by reducing rote work and producing consistently behaving module interfaces. The resulting methodology will provide a rapid prototyping environment for use in sensor integration, Operator Control Unit (OCU) development and autonomous vehicle control.

Electronics, Electronique, Optics, Optique, Physics, Physique, Sciences exactes et technologie, Exact sciences and technology, Physique, Physics, Domaines classiques de la physique (y compris les applications), Fundamental areas of phenomenology (including applications), Optique, Optics, Applications biologiques et médicales, Biological and medical applications, Applications industrielles, Industrial applications, Sciences appliquees, Applied sciences, Techniques et industries diverses, Other techniques and industries, Application laser, Laser beam applications, Application militaire, Military application, Aplicación militar, Etude expérimentale, Experimental study, Matériau diélectrique, Dielectric materials, Prototypage rapide, Rapid prototyping, Prototipificación rápida, Traitement matériau, Material processing, Tratamiento material, Traitement par laser, Laser assisted processing, 4262C, and 8920D

In this work we describe the use of laser direct-write for the rapid prototyping of frequency selective surfaces. Frequency selective surfaces are generally described by a periodic array of conducting or dielectric features (i.e. crosses, loops, grids, etc.) that when properly designed can pass or reject specific frequency bands of incoming electromagnetic radiation. While simple frequency selective surfaces are relatively straight forward to design and fabricate, operational demands, particularly military, have motivated the design and fabrication of much more complicated patterns. These new designs combine features of significantly different length scales, randomly dithered patterns and combinations of passive and active elements. We will demonstrate how laser direct-write is an ideal tool for the rapid prototyping of these new more complicated frequency selective surface designs. We will present experimental results for devices fabricated using several different laser direct-write processes.

Electronics, Electronique, Optics, Optique, Physics, Physique, Telecommunications, Télécommunications, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Telecommunications et theorie de l'information, Telecommunications and information theory, Théorie de l'information, du signal et des communications, Information, signal and communications theory, Traitement du signal, Signal processing, Traitement des images, Image processing, Sciences biologiques et medicales, Biological and medical sciences, Sciences medicales, Medical sciences, Informatique, statistique et modelisations biomedicales, Computerized, statistical medical data processing and models in biomedicine, Aide à la décision médicale. Aide au diagnostic, Medical management aid. Diagnosis aid, Image tridimensionnelle, Tridimensional image, Imagen tridimensional, Imagerie RMN, Nuclear magnetic resonance imaging, Imaginería RMN, Membre, Limb, Miembro, Modèle géométrique, Geometrical model, Modelo geométrico, Positionnement, Positioning, Posicionamiento, Prothèse, Prosthesis, Prótesis, Prototypage rapide, Rapid prototyping, Prototipificación rápida, Précision élevée, High precision, Precisión elevada, Rétroingénierie, Reverse engineering, Ingeniera inversa, Signal numérique, Digital signal, Señal numérica, Connecteur logiciel, Socket, and Conector software

The paper presents an innovative approach totally based on digital data to optimize lower limb socket prosthesis design. This approach is based on a stump's detailed geometric model and provides a substitute to plaster cast obtained through the traditional manual methodology with a physical model, realized with Rapid Prototyping technologies; this physical model will be used for the socket lamination. The paper discusses a methodology to reconstruct a 3D geometric model of the stump able to describe with high accuracy and detail the complete structure subdivided into bones, soft tissues, muscular masses and dermis. Some different technologies are used for stump acquisition: non contact laser technique for external geometry, CT and MRI imaging technologies for the internal structure, the first one dedicated to bones geometrical model, the last for soft tissues and muscles. We discuss problems related to 3D geometric reconstruction: the patient and stump positioning for the different acquisitions, markers' definition on the stump to identify landmarks, alignment's strategies for the different digital models, in order to define a protocol procedure with a requested accuracy for socket's realization. Some case-studies illustrate the methodology and the results obtained.

Electronics, Electronique, Metrology and instrumentation, Métrologie et instrumentation, Optics, Optique, Physics, Physique, Sciences exactes et technologie, Exact sciences and technology, Physique, Physics, Generalites, General, Instruments, appareillage, composants et techniques communs à plusieurs branches de la physique et de l'astronomie, Instruments, apparatus, components and techniques common to several branches of physics and astronomy, Instrumentation, équipement et techniques optiques, Optical instruments, equipment and techniques, Sciences appliquees, Applied sciences, Electronique, Electronics, Circuits électriques, optiques et optoélectroniques, Electric, optical and optoelectronic circuits, Propriétés des circuits, Circuit properties, Circuits optiques et optoélectroniques, Optical and optoelectronic circuits, Optique intégrée. Fibres et guides d'onde optiques, Integrated optics. Optical fibers and wave guides, Fibre optique, Optical fibers, Guide onde optique, Optical waveguides, Interféromètre Mach Zehnder, Mach-Zehnder interferometers, Méthacrylate de méthyle polymère, PMMA, Méthode mesure, Measuring methods, Méthode optique, Optical method, Método óptico, Prototypage rapide, Rapid prototyping, Prototipificación rápida, Tomographie, Tomography, and 4279G

In this paper we present the novel concept of tomography system for characterization of small phase microelements such as telecom fiber splices. We demonstrate the measurement method, existing setup and its modification towards creation of miniaturized waveguide based Mach-Zehnder interferometer for telecom fiber assessment. Additionally we present and analyze Deep Proton Writing as a promising technology for rapid prototyping of monolithic microinterferometer in PMMA.

Electronics, Electronique, Nanotechnologies, nanostructures, nanoobjects, Nanotechnologies, nanostructures, nanoobjets, Optics, Optique, Physics, Physique, Sciences exactes et technologie, Exact sciences and technology, Physique, Physics, Domaines classiques de la physique (y compris les applications), Fundamental areas of phenomenology (including applications), Optique, Optics, Applications biologiques et médicales, Biological and medical applications, Applications industrielles, Industrial applications, Application laser, Laser beam applications, Contrainte cisaillement, Shear stress, Tensión cizallamiento, Dispositif fluidique, Fluidic devices, Etude expérimentale, Experimental study, Fabrication industrielle, Manufacturing, Faisceau laser, Laser beams, Matière plastique, Plastics, Microstructure, Polymère, Polymers, Prototypage rapide, Rapid prototyping, Prototipificación rápida, Traitement par laser, Laser assisted processing, 4262C, Microfluidique, and Microfluidics

As a sequential production method, laser technology is considered not to be a competitor to established plastic processing methods, but instead is used whenever small numbers or just mere prototypes are required. Laser ablation by UV-excimer lasers is a flexible and accurate tool for the manufacturing of polymeric micro-fluidic parts. Even soft and flexible materials like PDMS that are difficult to machine with conventional techniques can be structured by laser ablation with great precision and quality. Sealing of polymer parts by laser beam welding leads to a complete production cycle for small series and prototypes. A further application of UV-excimer lasers is the production of so called lost moulds for the production of filigree microstructures. Micro-pillars are fabricated by drilling holes in wax masters using excimer laser radiation and subsequent casting with PDMS. Frictionless demolding is achieved by melting the wax away. The fabricated PDMS micro-pillar arrays can be used for shear stress and flow rate sensors due to bending of the flexible posts. In combination with laser ablation techniques micro-fluidic devices with new properties can be fabricated.

Electronics, Electronique, Optics, Optique, Physics, Physique, Sciences biologiques et medicales, Biological and medical sciences, Sciences biologiques fondamentales et appliquees. Psychologie, Fundamental and applied biological sciences. Psychology, Generalites, General aspects, Appareillage. Matériaux. Réactifs. Organisation du laboratoire de recherche, Instrumentation. Materials. Reagents. Research laboratory organization, Biotechnologie, Biotechnology, Méthodes. Procédés. Technologies, Methods. Procedures. Technologies, Cultures de cellules eucaryotes, Eukaryotic cell cultures, Généralités, Artiodactyla, Mammalia, Ungulata, Vertebrata, Application médicale laser, Laser applications in medicine, Biocompatibilité, Biocompatibility, Biocompatibilidad, Carbone dioxyde, Carbon dioxide, Carbono dióxido, Cytotoxicité, Cytotoxicity, Citotoxicidad, Enzyme, Enzima, Faisceau laser, Laser beam, Haz láser, Frittage, Sintering, Sinterización, In vitro, Laser IR, Infrared laser, Microparticule, Microparticle, Micropartícula, Mouton, Sheep, Carnero, Noir carbone, Carbon black, Carbón negro, Polymère, Polymer, Polímero, Polymérisation photochimique, Photopolymerization, Polimerización fotoquímica, Poudre, Powder, Polvo, Prototypage rapide, Rapid prototyping, Prototipificación rápida, Stéréolithographie, Stereolithography, Stereolitografia, 4262B, and 8780R

In present paper we describe the development of advanced laser stereolithography (LS) methodology based on photopolymerisation of a new liquid mixture of polyfunctional acrylic monomers and osteoinductive hydroxyapatite powder. Supercritical carbon dioxide treatment of LS samples introduced both surface and bulk microporosity for enhanced primary cell attachment and to remove toxic additives improving biocompatibility of the materials. The results of in vitro tests comprising human osteoblast cells attachment, spreading and proliferation on the implants demonstrate low level of their cytotoxicity and high level of biocompatibility. We also present a novel Surface Selective Laser Sintering (SSLS) technique for biodegradable polymer scaffolds fabrication from thermosensitive poly(D,L-lactic) - and poly(D,L-lactic-co-glycolic) acids - polymers, which have a wide spread occurrence in biomedical applications. Unlike conventional Selective Laser Sintering (where the powder particles melt because of their volumetric absorption of the laser radiation), in SSLS initiation of the sintering occur due to near IR laser beam absorption by a small amount (<0.1wt.%) of biocompatible carbon black microparticles uniformly distributed along the polymer powder surface. This technique enable to prevent any significant changes in polymer initial structures and even incorporate bioactive enzymes into the samples. The results of our in vitro studies using 3T3 fibroblast, C2C12 myoblast and ovine meniscal chondrocyte cells cultures hold great promise for use of produced scaffolds and developed technique in tissue engineering.

Electronics, Electronique, Optics, Optique, Physics, Physique, Sciences exactes et technologie, Exact sciences and technology, Physique, Physics, Domaines classiques de la physique (y compris les applications), Fundamental areas of phenomenology (including applications), Optique, Optics, Eléments, dispositifs, et systèmes optiques, Optical elements, devices, and systems, Processeurs, corrélateurs et modulateurs optiques, Optical processors, correlators, and modulators, Dispositifs d'affichage, dispositifs à cristaux liquides, Display devices, liquid-crystal devices, Sciences appliquees, Applied sciences, Electronique, Electronics, Circuits électriques, optiques et optoélectroniques, Electric, optical and optoelectronic circuits, Propriétés des circuits, Circuit properties, Circuits optiques et optoélectroniques, Optical and optoelectronic circuits, Optique intégrée. Fibres et guides d'onde optiques, Integrated optics. Optical fibers and wave guides, Analyse comportementale, Behavioral analysis, Análisis conductual, Cristal liquide ferroélectrique, Ferroelectric liquid crystals, Dispositif cristaux liquides, Liquid crystal devices, Effet température, Temperature effect, Efecto temperatura, Langage VHDL, VHDL language, Lenguaje VHDL, Modulateur optique spatial, Spatial light modulators, Prototype, Prototipo, 4279H, 4279K, Prototypage virtuel, and Virtual prototyping

A VHDL-AMS model of a surface-stabilized ferroelectric liquid crystal cell is presented in this paper. The model is based on the uniform FLC theory known since 1990. Although not quantitative, this approach gives us a good idea of the behaviour of such crystals. The model will be characterized and the results will be compared. Many related phenomena (effect of the temperature, ion transport ...) will be introduced to complete the behavioural description. The purpose of this work is the design of virtual prototype for a high-speed spatial light modulator.

Electronics, Electronique, Computer science, Informatique, Metrology and instrumentation, Métrologie et instrumentation, Optics, Optique, Physics, Physique, Telecommunications, Télécommunications, Sciences exactes et technologie, Exact sciences and technology, Physique, Physics, Generalites, General, Instruments, appareillage, composants et techniques communs à plusieurs branches de la physique et de l'astronomie, Instruments, apparatus, components and techniques common to several branches of physics and astronomy, Informatique en physique expérimentale, Computers in experimental physics, Traitement image, Image processing, Domaines classiques de la physique (y compris les applications), Fundamental areas of phenomenology (including applications), Optique, Optics, Formation des images et traitement optique, Imaging and optical processing, Formation et traitement des images, Image forming and processing, Eléments, dispositifs, et systèmes optiques, Optical elements, devices, and systems, Ordinateurs optiques, éléments logiques, dispositifs d'interconnexion, commutateurs; réseaux neuronaux, Optical computers, logic elements, interconnects, switches; neural networks, Sciences appliquees, Applied sciences, Telecommunications et theorie de l'information, Telecommunications and information theory, Théorie de l'information, du signal et des communications, Information, signal and communications theory, Traitement du signal, Signal processing, Traitement des images, Algorithme, Algorithms, Circuit intégré, Integrated circuits, Conception assistée, Computer aided design, Convolution, Image numérique, Digital image, Imagen numérica, Implémentation, Implementation, Optimisation, Optimization, Outil logiciel, Software tools, Prototypage rapide, Rapid prototyping, Prototipificación rápida, Réseau porte programmable, Field programmable gate arrays, Système temps réel, Real time systems, Traitement image, Image processing, 0705P, 4230V, and 4279T

In this article we present the local operations in image processing based upon spatial 2D discrete convolution. We study different implementation of such local operations. We also present the principles and the design flow of the AAA methodology and its associated CAD software tool for integrated circuit (SynDEx-IC). In this methodology, the algorithm is modeled by Conditioned (if - then - else) and Factorized (Loop) Data Dependence Graph and the optimized implementation is obtained by graph transformations. The AAA/SynDEx-IC is used to specify and to optimize the some digital image filters on FPGA XC2100 board.

Electronics, Electronique, Optics, Optique, Physics, Physique, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Electronique, Electronics, Electronique des semiconducteurs. Microélectronique. Optoélectronique. Dispositifs à l'état solide, Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices, Fabrication microélectronique (technologie des matériaux et des surfaces), Microelectronic fabrication (materials and surfaces technology), Stockage et lecture de l'information, Storage and reproduction of information, Mémoires de masse magnétiques et optiques, Magnetic and optical mass memories, Cuisson au four, Baking, Cocimiento al horno, Dispositif à mémoire, Memory devices, Effet proximité, Proximity effect, Efecto proximidad, Fabrication microélectronique, Microelectronic fabrication, Fabricación microeléctrica, Intensité faisceau, Beam currents, Modulation impulsion codage, Pulse code modulation, Modulación impulsión codificación, Méthode PECVD, PECVD, Procédé contact, Contact process, Procedimiento contacto, Résist, Resist, Resistencia, Temps exposition, Exposure time, Tiempo exposición, Trou interconnexion, Via hole, and Agujero interconexión

ZEP520A e-beam resist processes for 40 nm - 100 nm contact holes were studied for application of phase change memory (PCM) device prototyping. Post-application baking (PAB) temperature, post-development baking (PDB), e-beam currents, exposure doses, development time, and 3-types of development conditions on isolated and semi-dense (1:3) contact holes were investigated. Lowest PAB temperature for minimum exposure dose-to-size (ESIZE) is 70 °C. ESIZE of 200 °C PAB is about 250 μC/cm2 while that of 70 °C is 120 μC/cm2 for 100 nm contact hole. ESIZEof contact hole increases very quickly as the CD gets smaller than 60 nm. The CDs with beam currents of 100 pA and 200 pA are nearly the same while those with 2 nA differ very much. Sidewall profiles of contact holes exposed by 100 pA and 200 pA are near 90° while those exposed with 2 nA are tapered. It was found that ESIZE decreases with development time. The bottom of contact hole is broadened for prolonged development time. Contact hole CDs after PDB are generally kept as the original values. In general, there is little difference in CD between isolated and semi-dense patterns. The CD uniformity on the comer and center of contact-hole array (SEMBAR) are around 5% (3σ), showing a very weak proximity effect. Inter-layer mix-and-match processes were applied in the PCM manufacturing. TiW bottom electrode has the strongest signal waveform from the cross-shaped alignment marks than 250°C PECVD oxide and TiN/Ti. The mix-and-match PCM device structure is, for the first time, ever demonstrated.

Electronics, Electronique, Metrology and instrumentation, Métrologie et instrumentation, Optics, Optique, Physics, Physique, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Telecommunications et theorie de l'information, Telecommunications and information theory, Télécommunications, Telecommunications, Réseaux téléinformatiques. Rnis, Teleprocessing networks. Isdn, Dispositif optoélectronique, Optoelectronic device, Dispositivo optoelectrónico, Internet, Mise en service, Commissioning, Puesta en servicio, Prototype, Prototipo, 8920H, Photonique, and Photonics

The scope of this work encompasses an introduction to the design, set-up and internet commissioning of a virtual laboratory dedicated to photonics research support. General fundaments, as well as technically oriented details are discussed in the perspective of establishing an international measurements platform, in framework of European Research Area in the field of optoelectronics and photonics.

Electronics, Electronique, Computer science, Informatique, Optics, Optique, Physics, Physique, Telecommunications, Télécommunications, Sciences exactes et technologie, Exact sciences and technology, Physique, Physics, Generalites, General, Instruments, appareillage, composants et techniques communs à plusieurs branches de la physique et de l'astronomie, Instruments, apparatus, components and techniques common to several branches of physics and astronomy, Informatique en physique expérimentale, Computers in experimental physics, Analyse de données: algorithmes et implémentations; gestion de données, Data analysis: algorithms and implementation; data management, Algorithme, Algorithms, Analyse contenu, Content analysis, Análisis contenido, Architecture système, System architecture, Arquitectura sistema, Diminution coût, Cost lowering, Reducción costes, Monitorage, Monitoring, Monitoreo, Multimédia, Multimedia, Prototype, Prototipo, Système réparti, Distributed system, Sistema repartido, and 0705K

Many proposed video content analysis algorithms for surveillance applications are very computationally intensive, which limits the integration in a total system, running on one processing unit (e.g. PC). To build flexible prototyping systems of low cost, a distributed system with scalable processing power is therefore required. This paper discusses requirements for surveillance systems, considering two example applications. From these requirements, specifications for a prototyping architecture are derived. An implementation of the proposed architecture is presented, enabling mapping of multiple software modules onto a number of processing units (PCs). The architecture enables fast prototyping of new algorithms for complex surveillance applications without considering resource constraints.

Control theory, operational research, Automatique, recherche opérationnelle, Electronics, Electronique, Metrology and instrumentation, Métrologie et instrumentation, Optics, Optique, Physics, Physique, Telecommunications, Télécommunications, Sciences exactes et technologie, Exact sciences and technology, Physique, Physics, Generalites, General, Communication, éducation, histoire et philosophie, Communication, education, history, and philosophy, Littérature et publications en physique, Physics literature and publications, Actes de congrès, Conference proceedings, Domaines classiques de la physique (y compris les applications), Fundamental areas of phenomenology (including applications), Mécanique des solides, Solid mechanics, Mécanique des structures et des milieux continus, Structural and continuum mechanics, Vibration, onde mécanique, stabilité dynamique (aéroélasticité, contrôle vibration...), Vibration, mechanical wave, dynamic stability (aeroelasticity, vibration control...), Sciences appliquees, Applied sciences, Informatique; automatique theorique; systemes, Computer science; control theory; systems, Logiciel, Software, Systèmes informatiques et systèmes répartis. Interface utilisateur, Computer systems and distributed systems. User interface, Automatique théorique. Systèmes, Control theory. Systems, Robotique, Robotics, Assistance ordinateur, Computer aid, Asistencia ordenador, Automobile, Motor car, Automóvil, Boucle réaction, Feedback, Retroalimentación, Conception assistée, Computer aided design, Concepción asistida, Epitaxie phase vapeur, VPE, Interface haptique, Haptic interfaces, Interface utilisateur, User interface, Interfase usuario, Prototype, Prototipo, Réalité virtuelle, Virtual reality, Realidad virtual, Sensibilité tactile, Tactile sensitivity, Sensibilidad tactil, Synthèse mécanisme, Mechanism synthesis, Síntesis mecanismo, and 0130C

In determining the quality of a car, switch feeling is one of the important factors. Designing switches is time consuming because the relationships between characteristics of a desired switch and design parameters such as spring stiffness or stroke are not very clear, and furthermore, physical evaluation requires prototypes. A haptic Virtual Prototyping Environment (VPE), in which CAE (Computer-Aided Engineering) and haptic interface work together to display virtual feelings of mechanisms designed by CAD (Computer-Aided Design) will enable designers to feel the motions of the designed switches without prototypes. This paper presents design and quantitative evaluation of a haptic VPE for power window switches. We compared relationship between displacement and static reaction force, and acceleration during clicking motion. The similarity in the force vs stroke curve (FS curve) suggests the overall similarity in the feeling of the whole switch stroke. The acceleration showed some differences, which was felt as somewhat softer clicking effect. The lower frequency of the residual vibration of the haptic device indicates that the equivalent inertia of the haptic device is larger than that of the real switch. Although the overall motion of the switch stroke felt similar, quality of reality needs further refinement. Introduction of acceleration feedback for reducing the equivalent inertia is discussed.

Electronics, Electronique, Nanotechnologies, nanostructures, nanoobjects, Nanotechnologies, nanostructures, nanoobjets, Optics, Optique, Physics, Physique, Telecommunications, Télécommunications, Sciences exactes et technologie, Exact sciences and technology, Physique, Physics, Domaines classiques de la physique (y compris les applications), Fundamental areas of phenomenology (including applications), Optique, Optics, Eléments, dispositifs, et systèmes optiques, Optical elements, devices, and systems, Ordinateurs optiques, éléments logiques, dispositifs d'interconnexion, commutateurs; réseaux neuronaux, Optical computers, logic elements, interconnects, switches; neural networks, Dispositifs de micro- et nano-optique, Micro- and nanooptical devices, Analyse sensibilité, Sensitivity analysis, Dispositif optoélectronique, Optoelectronic devices, Fibre multimode, Multimode fibers, Grande vitesse, High speed, Gran velocidad, Interconnexion optique, Optical interconnections, Méthode Monte Carlo, Monte Carlo methods, Simulation numérique, Digital simulation, Surface optique, Optical surface, Superficie óptica, 4279T, Nanophotonique, Nanophotonics, Photonique, and Photonics

One of the remaining challenges to solve the interconnection bottlenecks at the Printed Circuit Board (PCB) and Multi-Chip-Module (MCM) level, is to adequately replace the galvanic interconnects with high-performance, low-cost, compact and reliable micro-photonic alternatives. At our labs of the Vrije Universiteit Brussel we are therefore optimizing and deploying a rapid micro-optical prototyping technology for micro-optical interconnect modules, which we call Deep Proton Writing (DPW). An advantge of the DPW process is that it can create steep micro-optical surfaces, micro-holes, micro-lenses and alignment features in one irradation step. Hence, relative accuracies are very well controlled. In this report, we will address more specifically the following components, made each with the DPW technology: 1) out-of-plane couplers for optical wave-guides embedded in PCB, 2) peripheral fiber ribbons and two dimensional single- and multimode fiber connectors for high-speed parallel optical connections, and 3) intra-MCM level optical interconnections via free-space optical modules. We will give special attention to the optical tolerancing and the opto-mechanical integration of components in their packages. We use both a sensitivity analysis to misalignment errors and Monte-Carlo simulations. It is our aim to investigate the whole component integration chain from the optoelectronic device packaging to the micro-opto-mechanical assembly of the interconnect module.

Control theory, operational research, Automatique, recherche opérationnelle, Electronics, Electronique, Metrology and instrumentation, Métrologie et instrumentation, Optics, Optique, Physics, Physique, Telecommunications, Télécommunications, Sciences exactes et technologie, Exact sciences and technology, Physique, Physics, Generalites, General, Communication, éducation, histoire et philosophie, Communication, education, history, and philosophy, Littérature et publications en physique, Physics literature and publications, Actes de congrès, Conference proceedings, Domaines classiques de la physique (y compris les applications), Fundamental areas of phenomenology (including applications), Optique, Optics, Eléments, dispositifs, et systèmes optiques, Optical elements, devices, and systems, Ordinateurs optiques, éléments logiques, dispositifs d'interconnexion, commutateurs; réseaux neuronaux, Optical computers, logic elements, interconnects, switches; neural networks, Sciences appliquees, Applied sciences, Informatique; automatique theorique; systemes, Computer science; control theory; systems, Automatique théorique. Systèmes, Control theory. Systems, Analyse des systèmes de commande, Control system analysis, Genie mecanique. Construction mecanique, Mechanical engineering. Machine design, Transmissions, Drives, Mécanismes articulés, cames, Linkage mechanisms, cams, Homme, Man, Locomotion, Locomoción, Mécanisme articulé, Linkage mechanism, Mecanismo articulado, Mécanisme entraînement, Drive mechanism, Mecanismo accionamiento, Mécanisme parallèle, Parallel mechanism, Mecanismo paralelo, Prototype, Prototipo, Roue, Wheels, Réseau porte programmable, Field programmable gate arrays, Système 3 degrés liberté, System with three degrees of freedom, Sistema 3 grados libertad, Système parallèle, Parallel system, Sistema paralelo, 0130C, and 4279T

A new kind of motion base is proposed for the purpose of setting up a user-friendly interaction system on the desktop. It aims at motion in various situations with a large range of movement using a simple mechanism, and generating motions adequate for an interaction with a man and for computer application. In this paper, a prototype of the motion base is developed. Its mechanism consists of a combination of a wheel drive locomotion mechanism and a 3-degrees of freedom (DOF) parallel link mechanism in parallel. It is aimed at generating 3 DOF translational motion on the desktop with a simple mechanism as a whole and with a large range of movement, especially in the horizontal direction. In consideration of application for man-computer interaction. the prototype is controlled by a microprocessor, a microcontroller and FPGA. This paper presents a description of the concept of the motion base for a desktop interaction system, the prototype mechanism, the control system and the preliminary experiment which demonstrates typical translational motions.

Electronics, Electronique, Metrology and instrumentation, Métrologie et instrumentation, Optics, Optique, Physics, Physique, Sciences exactes et technologie, Exact sciences and technology, Physique, Physics, Domaines classiques de la physique (y compris les applications), Fundamental areas of phenomenology (including applications), Optique, Optics, Formation des images et traitement optique, Imaging and optical processing, Fonctions de transfert optique et de transfert de modulation, Modulation and optical transfer functions, Acier, Steels, Cuivre alliage, Copper alloys, Etude expérimentale, Experimental study, Fabrication industrielle, Manufacturing, Fonction transfert modulation, Modulation transfer function, Función transferencia modulación, Grande vitesse, High speed, Gran velocidad, Méthacrylate de méthyle polymère, PMMA, Procédé fabrication, Manufacturing processes, Rugosité, Roughness, and 4230L

A network for prototyping imaging lenses using injection moulding was established in Finland. The network consists of several academic and industrial partners capable of designing, processing and characterising imaging lenses produced by injection moulding technology. In order to validate the operation of the network a demonstrator lens was produced. The process steps included in the manufacturing were lens specification, designing and modelling, material selection, mould tooling, moulding process simulation, injection moulding and characterisation. A magnifying imaging singlet lens to be used as an add-on in a camera phone was selected as a demonstrator. The design of the add-on lens proved to be somewhat challenging, but a double aspheric singlet lens design fulfilling nearly the requirement specification was produced. In the material selection task the overall characteristics profile of polymethyl methacrylate (PMMA) material was seen to be the most fitting to the pilot case. It is a low cost material with good moulding properties and therefore it was selected as a material for the pilot lens. Lens mould design was performed using I-DEAS and tested by using MoldFlow 3D injection moulding simulation software. The simulations predicted the achievable lens quality in the processing, when using a two-cavity mould design. First cavity was tooled directly into the mould plate and the second cavity was made by tooling separate insert pieces for the mould. Mould material was steel and the inserts were made from Moldmax copper alloy. Parts were tooled with high speed milling machines. Insert pieces were hand polished after tooling. Prototype lenses were injection moulded using two PMMA grades, namely 6N and 7N. Different process parameters were also experimented in the injection moulding test runs. Prototypes were characterised by measuring mechanical dimensions, surface profile, roughness and MTF of the lenses. Characterisations showed that the lens surface RMS roughness was 30-50 nm and the profile deviation was 5 μm from the design at a distance of 0.3 mm from the lens vertex. These manufacturing defects caused that the measured MTF values were lower than designed. The lens overall quality, however, was adequate to demonstrate the concept successfully. Through the implementation of the demonstrator lens we could test effectively different stages of the manufacturing process and get information about process component weight and risk factors and validate the overall performance of the network.

Electronics, Electronique, Optics, Optique, Physics, Physique, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Electronique, Electronics, Appareillage électronique et fabrication. Composants passifs, circuits imprimés, connectique, Electronic equipment and fabrication. Passive components, printed wiring boards, connectics, Circuits électriques, optiques et optoélectroniques, Electric, optical and optoelectronic circuits, Propriétés des circuits, Circuit properties, Circuits optiques et optoélectroniques, Optical and optoelectronic circuits, Optique intégrée. Fibres et guides d'onde optiques, Integrated optics. Optical fibers and wave guides, Divers, Miscellaneous, Telecommunications et theorie de l'information, Telecommunications and information theory, Télécommunications, Telecommunications, Télécommunications optiques, Optical telecommunications, A chaud, Hot process, En caliente, Carte électronique, Printed circuit board, Tarjeta electronica, Circuit imprimé, Printed circuit, Circuito imprimido, Conception compacte, Compact design, Concepción compacta, Coupleur fibre optique, Optical fiber couplers, Coupleur optique, Optical coupler, Acoplador óptico, Diminution coût, Cost lowering, Reducción costes, Fabrication microélectronique, Microelectronic fabrication, Fabricación microeléctrica, Fibre multimode, Multimode fibers, Guide onde optique, Optical waveguide, Guía onda óptica, Haute performance, High performance, Alto rendimiento, Interconnexion optique, Optical interconnection, Interconexión óptica, Microoptique, Microoptics, Microóptica, Modèle 2 dimensions, Two dimensional model, Modelo 2 dimensiones, Montage parallèle, Parallel connection, Acoplamiento derivación, Méthode ablation laser, Laser ablation technique, Nanolithographie, Nanolithography, Optique intégrée, Integrated optics, Optica integrada, Prototypage rapide, Rapid prototyping, Prototipificación rápida, Réplication, Replication, Replicación, Transducteur enfoui, Embedded transducer, Transductor embebido, Télécommunication optique, Optical telecommunication, Telecomunicación óptica, 4279G, 4279S, 4279T, Interconnexion espace libre, Free space interconnection, Interconexión espacio libre, Photonique, and Photonics

one of the grand challenges in solving the interconnection bottlenecks at the Printed Circuit Board (PCB) and Multi-Clip-Module (MCM) level, is to adequately replace the PCB and intra-MCM galvanic interconnects with high-performance, low-cost, compact and reliable micro-photonic alternatives. Therefore we address the following components in this paper: 1) out-of-plane couplers for optical waveguides embedded in PCB, 2) peripheral fiber ribbons and two-dimensional single- and multimode fiber connectors for high-speed parallel optical connections and 3) intra-MCM level optical interconnections via free-space optical modules. For the fabrication of these micro-optical interconnect modules, we are focusing at the Vrije Universiteit Brussel on the continuous development of a rapid prototyping technology, which we call Deep Proton Writing (DPW). The special feature of this prototyping technology is that it is compatible with commercial low-cost mass replication techniques such as micro injection moulding and hot embossing. Laser ablation is used at Ghent University for the fabrication of PCB-embedded waveguides and integrated micro-mirrors. The main advantage of this technology is that it is compatible with present-day PCB manufacturing. For the free-space MCM-level optical interconnect module, we furthermore give special attention to the optical tolerancing and the opto-mechanical integration of the components. We use both a sensitivity analysis to misaligniment errors and Monte Carlo simulations. It is our aim to investigate the whole component integration chain from the optoelectronic device to the micro-opto-mechanical components constituting the interconnect module.

Electronics, Electronique, Optics, Optique, Physics, Physique, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Electronique, Electronics, Appareillage électronique et fabrication. Composants passifs, circuits imprimés, connectique, Electronic equipment and fabrication. Passive components, printed wiring boards, connectics, Electronique des semiconducteurs. Microélectronique. Optoélectronique. Dispositifs à l'état solide, Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices, Fabrication microélectronique (technologie des matériaux et des surfaces), Microelectronic fabrication (materials and surfaces technology), Circuits électriques, optiques et optoélectroniques, Electric, optical and optoelectronic circuits, Propriétés des circuits, Circuit properties, Circuits optiques et optoélectroniques, Optical and optoelectronic circuits, Optique intégrée. Fibres et guides d'onde optiques, Integrated optics. Optical fibers and wave guides, Divers, Miscellaneous, Absorption 2 photons, Two photon absorption, Absorción 2 fotones, Carte électronique, Printed circuit board, Tarjeta electronica, Circuit déclenchement, Trigger, Circuito desenganche, Circuit imprimé, Printed circuit, Circuito imprimido, Couche épaisse, Thick film, Capa espesa, Dispositif optoélectronique, Optoelectronic device, Dispositivo optoelectrónico, Ecriture laser, Laser writing, Escritura láser, Etude expérimentale, Experimental study, Estudio experimental, Fabrication microélectronique, Microelectronic fabrication, Fabricación microeléctrica, Film polymère, Polymer films, Flexibilité, Flexibility, Flexibilidad, Guide onde optique, Optical waveguide, Guía onda óptica, Guide onde, Waveguide, Guía onda, Indice réfraction, Refraction index, Indice refracción, Interconnexion optique, Optical interconnection, Interconexión óptica, Laser guide onde, Waveguide laser, Laser guía onda, Lithographie, Lithography, Litografía, Matériau hybride organique minéral, Organic-inorganic hybrid materials, Matériau optique, Optical material, Material óptico, Microusinage, Micromachining, Micromaquinado, Optimisation, Optimization, Optimización, Optique intégrée, Integrated optics, Optica integrada, Optique non linéaire, Non linear optics, Optica no lineal, Perte optique, Optical losses, Photodiode, Fotodiodo, Placage par soudage, Cladding, Procédé fabrication, Manufacturing process, Procedimiento fabricación, Prototypage rapide, Rapid prototyping, Prototipificación rápida, Transducteur enfoui, Embedded transducer, Transductor embebido, 4265A, 4279G, and 4279T

The idea of applying the two-photon 3D lithography (2P-3DL) to an industrial printed wiring board (PWB) fabrication process is quite pioneering. Taking advantage of the unique rapid prototyping properties of 2P-3DL - its particularly inherent true 3D capability and its high flexibility in processing- this lithographic method can be adapted and optimized concerning the direct laser-writing of integrated optical interconnects with tens of microns in diameter. This will push the method forward towards industrial fabrication of next generation PWBs with integrated optical layers, and put it on the leading edge of printed circuit board (PCB) technology. In this context, the concept of a direct laser-written embedded waveguide is based on the local increase of the refractive index of the exposed material, which is triggered by two-photon absorption (TPA) at the laser focus. The laser induced refractive index difference forms the core of the waveguide, whereas the unexposed surrounding material forms the cladding. Thus, only one optical material is required to form the waveguide using true 3D lithographic process compared to other devices, which significantly simplifies processes. The material is subject to stringent requirements concerning the PWB production process: beside its high refractive index change, a low optical loss of the fabricated optical interconnect is required. The integration of the waveguide into the volume of the material also requires thick films up to 500 μm on the PWB substrate, and the material has to withstand the complete PWB fabrication process, where the board is chemically treated and exposed to high temperatures as well as high pressure during the lamination processes of subsequent metal layers. For this application, an inorganic-organic hybrid polymer (ORMOCER®) film is applied, casted onto a PWB substrate, and the two-photon 3D lithography system parameters and optics are tuned such that waveguides with a diameter of approx. 30 μm can be inscribed. The board is equipped with laser- and photodiodes, which are totally covered by the thick ORMOCER® film. The integration of the waveguide in such a preconfigured board requires precise 3D registration of the sample prior to the waveguide writing in order to align the waveguide relative to the optoelectronic components. By means of the 3D registration, the waveguide alignment is an inherent part of the fabrication process. The 3D capabilities of the 2P-3DL permit not only the fabrication of single embedded waveguides with a simple geometry, but also more complex waveguide structure (e.g. bundles) with largely arbitrary waveguide configurations. In this paper, we present the development and realization of the two-photon 3D lithography for the fabrication of integrated optical interconnects on PWBs.

Control theory, operational research, Automatique, recherche opérationnelle, Electronics, Electronique, Optics, Optique, Physics, Physique, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Informatique; automatique theorique; systemes, Computer science; control theory; systems, Automatique théorique. Systèmes, Control theory. Systems, Robotique, Robotics, Analyse comportementale, Behavioral analysis, Análisis conductual, Arbre graphe, Tree(graph), Arbol grafo, Caverne, Cave, Caverna, Commande mouvement, Motion control, Control movimiento, Comportement grimpeur, Climbing behavior, Comportamiento trepador, Conception assistée, Computer aided design, Concepción asistida, Multidisciplinaire, Multidisciplinary, Multidisciplinar, Prototypage rapide, Rapid prototyping, Prototipificación rápida, Robot mobile, Moving robot, Robot móvil, Robotique, Robotics, Robótica, Surface rugueuse, Rough surface, Superficie rugosa, Système autonome, Autonomous system, Sistema autónomo, Tôle, Sheet metal, Chapa, Verre, Glass, and Vidrio

We review a large multidisciplinary effort to develop a family of autonomous robots capable of rapid, agile maneuvers in and around natural and artificial vertical terrains such as walls, cliffs, caves, trees and rubble. Our robot designs are inspired by (but not direct copies of) biological climbers such as cockroaches, geckos, and squirrels. We are incorporating advanced materials (e.g., synthetic gecko hairs) into these designs and fabricating them using state of the art rapid prototyping techniques (e.g., shape deposition manufacturing) that permit multiple iterations of design and testing with an effective integration path for the novel materials and components. We are developing novel motion control techniques to support dexterous climbing behaviors that are inspired by neuroethological studies of animals and descended from earlier frameworks that have proven analytically tractable and empirically sound. Our near term behavioral targets call for vertical climbing on soft (e.g., bark) or rough surfaces and for ascents on smooth, hard steep inclines (e.g., 60 degree slopes on metal or glass sheets) at one body length per second.

Electronics, Electronique, Optics, Optique, Physics, Physique, Telecommunications, Télécommunications, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Electronique, Electronics, Matériaux, Materials, Electronique des semiconducteurs. Microélectronique. Optoélectronique. Dispositifs à l'état solide, Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices, Fabrication microélectronique (technologie des matériaux et des surfaces), Microelectronic fabrication (materials and surfaces technology), Circuits électriques, optiques et optoélectroniques, Electric, optical and optoelectronic circuits, Propriétés des circuits, Circuit properties, Circuits optiques et optoélectroniques, Optical and optoelectronic circuits, Optique intégrée. Fibres et guides d'onde optiques, Integrated optics. Optical fibers and wave guides, Analyse donnée, Data analysis, Análisis datos, Calcul erreur, Error analysis, Cálculo error, Choix matériau, Material selection, Selección material, Compatibilité, Compatibility, Compatibilidad, Dispositif électromécanique, Electromechanical device, Dispositivo electromecánico, Défaut alignement, Alignment defect, Defecto alineación, Elément optique, Optical elements, Estimation erreur, Error estimation, Estimación error, Fabrication microélectronique, Microelectronic fabrication, Fabricación microeléctrica, Implémentation, Implementation, Implementación, Micromachine, Micromáquina, Microoptique, Microoptics, Microóptica, Microusinage, Micromachining, Micromaquinado, Microélectronique, Microelectronics, Microelectrónica, Méthode optique, Optical method, Método óptico, Optique intégrée, Integrated optics, Optica integrada, Procédé fabrication, Manufacturing process, Procedimiento fabricación, Prototypage rapide, Rapid prototyping, Prototipificación rápida, Simulation, Simulación, Système électromécanique, Electromechanical system, Sistema electromecánico, Technique rapide, Rapid technique, and Técnica rápida

On the basis of close analysis of the drawback in conventional fabrication techniques of binary optical element, this paper presents a new method for fabricating optical element. This method can be called transverse-adding fabrication technique(TAFT), and it is developed from the rapid prototyping technique used in microelectronic processing and micro-machining. The principal objective developing this technique is to realize the compatibility of micro-optics with microelectronics and micro-machining technique to provide technical support for the integrated single-chip micro photo-electromechanical system. An explanation for the technological principle and process of this technique is stated. By analyzing experimental data, the selection of materials and corresponding process parameters for implementing this technique were determined. The main process error of this technique, alignment error, was analyzed and calculated. In addition, a computerized simulation was carried out. Analysis shows that this technique can not only fabricate continuous phase component, its diffraction efficiency is insensitive to the alignment error as well. It is therefore clear that the transverse-adding fabrication technique is a feasible technique for fabricating binary optical elements and has an advantage over conventional techniques in fabricating precision.

Electronics, Electronique, Optics, Optique, Physics, Physique, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Electronique, Electronics, Appareillage électronique et fabrication. Composants passifs, circuits imprimés, connectique, Electronic equipment and fabrication. Passive components, printed wiring boards, connectics, Electronique des semiconducteurs. Microélectronique. Optoélectronique. Dispositifs à l'état solide, Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices, Circuits intégrés, Integrated circuits, Conception. Technologies. Analyse fonctionnement. Essais, Design. Technologies. Operation analysis. Testing, Circuits électriques, optiques et optoélectroniques, Electric, optical and optoelectronic circuits, Propriétés des circuits, Circuit properties, Circuits optiques et optoélectroniques, Optical and optoelectronic circuits, Optique intégrée. Fibres et guides d'onde optiques, Integrated optics. Optical fibers and wave guides, Divers, Miscellaneous, Analyse coût efficacité, Cost efficiency analysis, Análisis costo eficacia, Carte électronique, Printed circuit board, Tarjeta electronica, Conception compacte, Compact design, Concepción compacta, Coupleur fibre optique, Optical fiber couplers, Coupleur optique, Optical coupler, Acoplador óptico, Diminution coût, Cost lowering, Reducción costes, Fabrication microélectronique, Microelectronic fabrication, Fabricación microeléctrica, Fibre multimode, Multimode fibers, Guide onde optique, Optical waveguide, Guía onda óptica, Haute performance, High performance, Alto rendimiento, Interconnexion optique, Optical interconnection, Interconexión óptica, Microoptique, Microoptics, Microóptica, Module multipuce, Multichip module, Modulo multipulga, Modèle 2 dimensions, Two dimensional model, Modelo 2 dimensiones, Montage parallèle, Parallel connection, Acoplamiento derivación, Optique intégrée, Integrated optics, Optica integrada, Optique sans fil, Free space optics, Optica inalámbrica, Propagation espace libre, Free space propagation, Propagation onde électromagnétique, Electromagnetic wave propagation, Proton, Protón, Prototypage rapide, Rapid prototyping, Prototipificación rápida, Télécommunication optique, Optical telecommunication, Telecomunicación óptica, Télécommunication sans fil, Wireless telecommunication, Telecomunicación sin hilo, 4120J, 4225B, 4279G, 4279S, 4279T, Interconnexion espace libre, Free space interconnection, Interconexión espacio libre, Photonique, and Photonics

One of the grand challenges in solving the interconnection bottlenecks at the Printed Circuit Board (PCB) and Multi-Chip-Module (MCM) level, is to adequately replace the PCB and intra-MCM galvanic interconnects with high-performance, low-cost, compact and reliable micro-photonic alternatives. Therefore we address the following components in this paper: 1) out-of-plane couplers for optical waveguides embedded in PCB, 2) peripheral fiber ribbons and two-dimensional single- and multimode fiber connectors for high-speed parallel optical connections, and 3) intra-MCM level optical interconnections via free-space optical modules. For the fabrication of these micro-optical interconnect modules, we are focusing at the Vrije Universiteit Brussel on the continuous development of a rapid prototyping technology, which we call Deep Proton Writing (DPW). The special feature of this prototyping technology is that it is compatible with commercial low-cost mass replication techniques such as micro injection moulding and hot embossing. Laser ablation is used at Ghent University for the fabrication of PCB-embedded waveguides and integrated micro-mirrors. The main advantage of this technology is that it is compatible with present-day PCB manufacturing. For the free-space MCM-level optical interconnect module, we furthermore give special attention to the optical tolerancing and the opto-mechanical integration of the components. We use both a sensitivity analysis to misalignment errors and Monte Carlo simulations. It is our aim to investigate the whole component integration chain from the optoelectronic device to the micro-opto-mechanical components constituting the interconnect module.