Telecommunications, Télécommunications, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Telecommunications et theorie de l'information, Telecommunications and information theory, Télécommunications, Telecommunications, Radiocommunications, Antennes, Antennas, Alimentation antenne, Antenna feeds, Antenne lentille, Lens antenna, Antena lentiforme, Application spatiale, Space application, Aplicación espacial, Bande X, X band, Banda X, Constante diélectrique, Permittivity, Constante dieléctrica, Gradient indice, Gradient index, Gradiente indicativo, Guide onde, Waveguide, Guía onda, Implémentation, Implementation, Implementación, Lobe latéral, Lateral lobe, Lóbulo lateral, Matière plastique, Plastics, Material plástico, Méthode élément fini, Finite element method, Método elemento finito, Onde centimétrique, Centimetric wave, Onda centimétrica, Prototypage rapide, Rapid prototyping, Prototipificación rápida, Simulation, Simulación, Luneburg lens, lens antenna, and rapid prototyping

In this work, we designed, built, and tested a low-gain 20 dBi Luneburg Lens antenna using a rapid prototyping machine as a proof of concept demonstrator. The required continuously varying relative permittivity profile was implemented by changing the size of plastic blocks centered on the junctions of a plastic rod space frame. A 12-cm (4λ0 at 10 GHz) diameter lens is designed to work at X-band. The effective permittivity of the unit cell is calculated by effective medium theory and simulated by full-wave finite-element simulations. The fabrication is implemented by a polymer jetting rapid prototyping method. In the measurement, the lens antenna is fed by an X-band waveguide. The measured gain of the antenna at X-band is from 17.3 to 20.3 dB. The measured half-power beam width is from 19° to 12.7° while the side lobes are about 25 dB below the main peak. Good agreement between simulation and experimental results is obtained.

Telecommunications, Télécommunications, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Telecommunications et theorie de l'information, Telecommunications and information theory, Télécommunications, Telecommunications, Radiocommunications, Antennes, Antennas, Antenne fil, Wire antenna, Antena hilo, Antenne hélicoïdale, Helical antenna, Antena helicoidal, Antenne sphérique, Spherical antenna, Antena esférica, Impression, Printing, Impresión, Prototypage rapide, Rapid prototyping, Prototipificación rápida, Stratification, Estratificación, 3D printing, electrically small antennas, nanocrystalline copper, rapid prototyping, selective laser sintering, and spherical antennas

It is shown how modern rapid prototyping technologies can be applied for quick and inexpensive, but still accurate, fabrication of electrically small wire antennas. A well known folded spherical helix antenna and a novel spherical zigzag antenna have been fabricated and tested, exhibiting the impedance and radiation characteristics in close agreement with those predicted numerically.

Electrical engineering, Electrotechnique, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Electrotechnique. Electroenergetique, Electrical engineering. Electrical power engineering, Machines électriques, Electrical machines, Régulation et commande, Regulation and control, Appareillage de connexion et de protection, Connection and protection apparatus, Electroénergétique, Electrical power engineering, Réseaux et lignes électriques, Power networks and lines, Postes et sous-stations, Substations, Exploitation. Commande de charge. Fiabilité, Operation. Load control. Reliability, Automatisation, Automation, Automatización, Basse tension, Low voltage, Baja tensión, Communication donnée, Data communication, Description système, System description, Descripción sistema, Dispositif protection, Protective device, Dispositivo protección, Délestage, Load shedding, Dejamiento programado de carga, Flexibilité, Flexibility, Flexibilidad, Génération code, Code generation, Generación código, Implémentation, Implementation, Implementación, Modélisation, Modeling, Modelización, Norme CEI, IEC standard, Norma IEC, Organisation système, System configuration, Organización sistema, Orienté objet, Object oriented, Orientado objeto, Poste électrique, Substation, Puesto eléctrico, Prototypage rapide, Rapid prototyping, Prototipificación rápida, Prototype, Prototipo, Prévention dommage, Damage prevention, Prevención daño, Recherche et développement, Research and development, Investigación desarrollo, Réseau distribution, Distribution network, Red distribución, Réseau électrique, Electrical network, Red eléctrica, Système commande, Control system, Sistema control, Système réparti, Distributed system, Sistema repartido, Transmission message, Message transmission, Transmisión mensaje, Automation and control, IEC 61850, code generation, communications, microgrids, power system protection, and rapid prototyping

Communications is becoming increasingly important to the operation of protection and control schemes. Although offering many benefits, using standards-based communications, particularly IEC 61850, in the course of the research and development of novel schemes can be complex. This paper describes an open-source platform which enables the rapid prototyping of communications-enhanced schemes. The platform automatically generates the data model and communications code required for an intelligent electronic device to implement a publisher-subscriber generic object-oriented substation event and sampled-value messaging. The generated code is tailored to a particular system configuration description (SCD) file, and is therefore extremely efficient at runtime. It is shown here how a model-centric tool, such as the open-source Eclipse Modeling Framework, can be used to manage the complexity of the IEC 61850 standard, by providing a framework for validating SCD files and by automating parts of the code generation process. The flexibility and convenience of the platform are demonstrated through a prototype of a real-time, fast-acting load-shedding scheme for a low-voltage microgrid network. The platform is the first open-source implementation of IEC 61850 which is suitable for real-time applications, such as protection, and is therefore readily available for research and education.

Electrical engineering, Electrotechnique, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Electronique, Electronics, Electronique des semiconducteurs. Microélectronique. Optoélectronique. Dispositifs à l'état solide, Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices, Dispositifs magnétiques, Magnetic devices, Circuits électriques, optiques et optoélectroniques, Electric, optical and optoelectronic circuits, Propriétés des circuits, Circuit properties, Circuits électroniques, Electronic circuits, Convertisseurs de signal, Signal convertors, Electrotechnique. Electroenergetique, Electrical engineering. Electrical power engineering, Transformateurs et inductances, Transformers and inductors, Electronique de puissance, alimentations électriques, Power electronics, power supplies, Algorithme, Algorithm, Algoritmo, Champ fuite, Leakage flux, Campo fuga, Circuit résonnant, Resonant circuit, Circuito resonante, Conception système, System design, Concepción sistema, Convertisseur puissance résonnant, Resonant power convertors, Convertisseur puissance, Power converter, Convertidor potencia, Dimensionnement, Dimensioning, Dimensionamiento, Dispositif magnétique, Magnetic device, Dispositivo magnético, Electronique puissance, Power electronics, Electrónica potencia, Enroulement machine, Machine windings, Entrefer, Air gap, Entrehierro, Etude théorique, Theoretical study, Estudio teórico, Evaluation performance, Performance evaluation, Evaluación prestación, Inductance, Inductancia, Méthode itérative, Iterative method, Método iterativo, Méthode élément fini, Finite element method, Método elemento finito, Noyau magnétique, Magnetic core, Núcleo magnético, Optimisation, Optimization, Optimización, Simulation système, System simulation, Simulación sistema, Transfert énergie, Energy transfer, Transferencia energía, Transformateur puissance, Power transformer, Transformador potencia, Transmission énergie, Power transmission, Energie réactive, Reactive energy, Prototypage virtuel, Virtual prototyping, Contactless energy transfer, design methodology, inductively coupled power transfer (ICPT), resonant converter, and virtual prototyping

This paper presents a design methodology dedicated to a two-winding transformer with large air gap and magnetic cores. To design this kind of components, it is necessary to consider the influence of inductive parameters on electrical magnitudes and the converter, which supplies this magnetic device. Indeed, this kind of a magnetic device has a large leakage inductance and a small magnetizing inductance. Therefore, to transfer the desired power, the transformer needs important reactive energy to magnetize magnetic core and to provide leakage flux. Like inductive parameters can be determined only when geometry is known, sizing has to be iterative. Moreover, resonant converters can be used to compensate inductive behavior, but modify electrical constraints of the transformer. A robust algorithm of design and all necessary tools are presented in order to make it easier to size such components. After the analytical design, 3-D FEM simulations and experimental measurements have been carried out in order to validate the theoretical study. Moreover, the power electronics converter has been optimized in order to improve the efficiency of power transfer. A prototype of 1.6 kW 100 kHz with an air gap of 6 mm has been realized with its converter. The global efficiency is 93.3%.

Electronics, Electronique, Sciences exactes et technologie, Exact sciences and technology, Physique, Physics, Generalites, General, Instruments, appareillage, composants et techniques communs à plusieurs branches de la physique et de l'astronomie, Instruments, apparatus, components and techniques common to several branches of physics and astronomy, Techniques et équipements généraux, General equipment and techniques, Capteurs (chimiques, optiques, électriques, de mouvement, de gaz, etc.); télédétection, Sensors (chemical, optical, electrical, movement, gas, etc.); remote sensing, Sciences appliquees, Applied sciences, Electronique, Electronics, Electronique des semiconducteurs. Microélectronique. Optoélectronique. Dispositifs à l'état solide, Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices, Circuits intégrés, Integrated circuits, Conception. Technologies. Analyse fonctionnement. Essais, Design. Technologies. Operation analysis. Testing, Dispositifs à images, Imaging devices, Circuits électriques, optiques et optoélectroniques, Electric, optical and optoelectronic circuits, Propriétés des circuits, Circuit properties, Circuits électroniques, Electronic circuits, Convertisseurs de signal, Signal convertors, Assemblage circuit intégré, Integrated circuit bonding, Capteur image CMOS, CMOS image sensors, Capteur mesure, Measurement sensor, Captador medida, Circuit intégré, Integrated circuit, Circuito integrado, Contact bosse, Solder bump, Contacto con bollos, Convertisseur AN, AD converter, Convertidor AN, Cuivre, Copper, Cobre, Echantillonnage, Sampling, Muestreo, Empilement, Stacking, Apilamiento, Haute performance, High performance, Alto rendimiento, Image tridimensionnelle, Tridimensional image, Imagen tridimensional, Interconnexion, Interconnection, Interconexión, Matrice formage, Die, Matriz formadora, Multifonctionnalité, Multifunctionality, Multifuncionalidad, Prototypage rapide, Rapid prototyping, Prototipificación rápida, Prototype, Prototipo, Silicium, Silicon, Silicio, Structure 3 dimensions, Three dimensional structure, Estructura 3 dimensiones, Surface arrière, Back surface, Superficie atrás, Système intégré, Integrated system, Sistema integrado, Trou interconnexion, Via hole, Agujero interconexión, 0707D, Backside through silicon via (TSV), die-level 3-D integration, and hetero-integrated system

We proposed a die-level 3-D integration technology for rapid prototyping of high-performance multifunctionality hetero-integrated systems. Commercially available 2-D chips with different functions and sizes could be processed and integrated in die level. To realize the die-level 3-D integration, fine-sized backside through silicon via (TSV) and novel detachable technologies are developed. In this paper, we demonstrated a prototype 3-D stacked image sensor system using the die-level 3-D integration technology. Three different functional chips of CMOS image sensor, correlated double sampling, and analog-to-digital converter, which were fabricated by different technologies, were processed to form fine-sized backside Cu TSV of 5-μm diameter and metal microbumps in die level. Each chip was sequentially stacked after evaluating the basic function to form a known-good-die 3-D stacked system. The fundamental characteristics of each functional chip were successfully evaluated in the fabricated prototype 3-D stacked image sensor system.

Electronics, Electronique, Mechanics acoustics, Mécanique et acoustique, Physics, Physique, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Industrie des polymeres, peintures, bois, Polymer industry, paints, wood, Technologie des polymères, Technology of polymers, Appareillage et mise en oeuvre, Machinery and processing, Matières plastiques, Plastics, Moulage, Moulding, Additif antigrippant, Antisticking additive, Aditivo antiagarrotante, Angle contact, Contact angle, Angulo contacto, Cuivre, Copper, Cobre, Dispositif microélectromécanique, Microelectromechanical device, Dispositivo microelectromecánico, Epoxyde résine, Epoxy resin, Epóxido resina, Etude expérimentale, Experimental study, Estudio experimental, Force adhérence, Adhesive strength, Fuerza adherencia, Formage à chaud, Hot forming, Termoconformado, Gaufrage, Embossing, Gofrado, Matériau hybride, Hybrid material, Material híbrido, Moule composite, Composite mold, Molde compuesto, Photorésist, Photoresist, Fotorresistencia, Profilométrie, Profilometry, Perfilometría, Prototypage rapide, Rapid prototyping, Prototipificación rápida, Revêtement métallique, Metal coating, Revestimiento metálico, Lithographie douce, Soft lithography, Litografía blanda, Hot embossing, SU-8 molds, and rapid prototyping

In this paper, we have developed a rapid prototyping process using hybrid master molds for hot-embossing lithography. The hybrid master mold developed here typically consists of a structural layer of SU-8, an overlayer of copper, and a top layer of antistick compound. The structure is first formed by the negative photoresist SU-8 layer with conventional photolithography. On the structural SU-8 layer, a nanoscale copper thin film is deposited to enhance the mechanical strength of the mold and improve heat transfer during the hot-embossing process. Finally, an outermost antistick layer is formed by the reaction of trichloro-(1H,1H,2H,2H-perfluoroctyl)-silane with the oxidized copper surface. These three layers cooperatively yield a hybrid mold which can be fabricated on a silicon wafer or any other suitable substrates for subsequent hot-embossing lithography. Our tests have verified that the molds fabricated with this method do not show any degradation of their structural design features and surface smoothness after 30 hot-embossing cycles. In comparison to other methods of making master molds for hot-embossing lithography such as laser machining and electroplating, the present method is simple and fast, with no reliance on any additional replication steps and fabrication procedures. Hence, the present method can remarkably reduce cost and the processing time in hot embossing, which is particularly attractive in prototyping or small volume production.

Electronics, Electronique, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Electronique, Electronics, Electronique des semiconducteurs. Microélectronique. Optoélectronique. Dispositifs à l'état solide, Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices, Circuits intégrés, Integrated circuits, Conception. Technologies. Analyse fonctionnement. Essais, Design. Technologies. Operation analysis. Testing, Fabrication microélectronique (technologie des matériaux et des surfaces), Microelectronic fabrication (materials and surfaces technology), Acier inoxydable, Stainless steel, Acero inoxidable, Assemblage circuit intégré, Integrated circuit bonding, Aérosol, Aerosols, Aerosol, Circuit intégré, Integrated circuit, Circuito integrado, Circuit électrique, Electric circuit, Circuito eléctrico, Complexité temps, Time complexity, Complejidad tiempo, Contact bosse, Solder bump, Contacto con bollos, Coût fabrication, Manufacturing cost, Costo fabricación, Espacement, Spacing, Espaciamiento, Interconnexion, Interconnection, Interconexión, Masque, Mask, Máscara, Matériau stratifié, Stratified material, Material estratificado, Micromachine, Micromáquina, Méthode ablation laser, Laser ablation technique, Nanoparticule, Nanoparticle, Nanopartícula, Packaging électronique, Electronic packaging, Packaging electrónico, Photolithographie, Photolithography, Fotolitografía, Planarisation, Planarization, Planarización, Procédé voie sèche, Dry process, Procedimiento vía seca, Prototypage rapide, Rapid prototyping, Prototipificación rápida, Puce à bosses, Flip-chip, Système production, Production system, Sistema producción, Sérigraphie, Serigraphy, Serigrafía, Technologie planaire, Planar technology, Tecnología planar, Thermoplastique, Thermoplastics, Termoplástica, Trou interconnexion, Via hole, Agujero interconexión, Chip first, embedded actives, high-density interconnect, nano-particle silver, and rapid prototyping

To reduce manufacturing cost, lead time, and process complexity, an embedded-active approach that targets rapid prototyping and low-volume production in micro-system packaging is being developed. The approach involves a rapid prototyping of micro-system packaging by a data-driven chip-first packaging process using direct printing of nano-particle metals. In the chip-first process, bare dice are first embedded into a copper or stainless steel carrier substrate, fixed by filling the gap between the chips and the substrate with thermoplastic adhesives, and planarized to a common planar surface. On the coplanar substrate, polyimide film is laminated to form a dielectric layer. Through the dielectric layer to the chip metal pads, micro vias are drilled by laser ablation. The vias are filled with nano-particle silver (NPS). The NPS is deposited by screen printing or aerosol-jet printing and an electrical circuit is formed. This packaging approach is a dry process and it does not require any photo masks for circuit patterning, resulting in reducing packaging turn-around time from months to days. It is also less limited by substrate composition and morphology, eliminates the need for special chip processing such as flip chip solder bumps, and permits using any chip technology and any chip supplier allowing mixed devices. The embedded-active process with NPS avoids the extreme processing conditions required for standard IC fabrication such as wet chemistry processing and vacuum sputtering. The NPS can be sintered at plastic-compatible temperatures as low as 230 °C to form material nearly indistinguishable from the bulk metal. The embedded-active packaging shows good reliability performance in terms of thermal shock, which is performed in the range of ―40 ° C and 125 °C. These results represent an important step to a system packaging characterized by high-density, low-cost, and data-driven fabrication for rapid package prototyping. This paper presents details of the rapid prototyping process sequence, an initial reliability characterization of the package architecture, and a failure mode analysis of the packages.

Nuclear physics, Physique nucléaire, Plasma physics, Physique des plasmas, Sciences exactes et technologie, Exact sciences and technology, Physique, Physics, Physique des gaz, des plasmas et des decharges electriques, Physics of gases, plasmas and electric discharges, Physique des plasmas et décharges électriques, Physics of plasmas and electric discharges, Confinement magnétique et équilibre, Magnetic confinement and equilibrium, Tokamaks, Conception, Design, Confinement magnétique, Magnetic confinement, Etude théorique, Theoretical study, Logiciel, Computer software, Modèle mathématique, Mathematical models, Modélisation, Modelling, Plasma confiné, Confined plasma, Plasma confinado, Système commande, Control systems, Sécurité, Safety, Tokamak ITER, ITER tokamak, 5255F, Hardware-in-the-loop (HIL) simulations, ITER, model-based design, and rapid prototyping

The ITER tokamak (Latin for the way) is the next step toward the realization of electricity-producing fusion power plants, since it has been designed to reach the plasma burning condition. The Central Safety System for Nuclear Risk (CSS) is the control system in charge to assure nuclear safety for the ITER plant, the personnel, and the environment. Since the CSS is a critical safety system, its validation and commissioning play an important role, and the required level of reliability must be demonstrated. In such a scenario, it is strongly recommended to use modeling and simulation tools since the early design phase. Indeed, mathematical models will help in the definition of the control system requirements. These models can be used for the rapid prototyping of the safety system, and hardware-in-the-loop (HIL) simulations can be performed to assess the performance of the control hardware against a plant simulator. This paper introduces the methodology and the software/hardware architecture used to develop both a CSS prototype and a ITER plant model suitable for the test and validation of this prototype.

Telecommunications, Télécommunications, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Telecommunications et theorie de l'information, Telecommunications and information theory, Télécommunications, Telecommunications, Radiocommunications, Antennes, Antennas, Antenne Vivaldi, Vivaldi antenna, Antena Vivaldi, Antenne fente, Slot antenna, Antena ranurada, Antenne réseau fente, Slot antenna arrays, Bande Ka, Ka band, Banda Ka, Carte électronique, Printed circuit board, Tarjeta electronica, Circuit intégré hybride, Hybrid integrated circuit, Circuito integrado híbrido, Circuit passif, Passive circuit, Circuito pasivo, Diagramme rayonnement, Radiation pattern, Diagrama radiación, Diminution coût, Cost lowering, Reducción costes, Dispositif onde millimétrique, Millimeter wave devices, Empilement, Stacking, Apilamiento, Ligne coaxiale, Coaxial line, Línea coaxial, Ligne transmission, Transmission line, Línea transmisión, Micromachine, Micromáquina, Prototype, Prototipo, Simulation, Simulación, Sous système, Subsystem, Subsistema, Système RF, RF systems, Réseau d'antennes, Antenna array, Antenna arrays, RF and microwave systems, Vivaldi antennas, coaxial line, hybrid integrated circuits, micromachined transmission lines, and passive circuits

A stacked printed circuit board (PCB) approach for prototyping 3-D microfabrication enabled millimeter and submillimeter wave components and subsystems is proposed. To demonstrate this approach, a 4 to 8 GHz two element tapered slot antenna array with integrated rectangular coaxial 90° hybrid, and its stand-alone elements, are designed and fabricated. Measured subsystem results show properly formed radiation patterns, realized gain from 9 to 11 dBi, and 3-dB beamwidth from 30° to 45°. Excellent agreement between simulations and measurements of individual components and the full subsystem as well as outcomes of a tolerance study and comparison to a Ka band micromachined subsystem confirm suitability of the proposed approach for fast, low-cost prototyping of 3-D micromachined rectangular coaxial components and subsystems.

Electronics, Electronique, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Electronique, Electronics, Electronique des semiconducteurs. Microélectronique. Optoélectronique. Dispositifs à l'état solide, Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices, Circuits intégrés, Integrated circuits, Conception. Technologies. Analyse fonctionnement. Essais, Design. Technologies. Operation analysis. Testing, Fabrication microélectronique (technologie des matériaux et des surfaces), Microelectronic fabrication (materials and surfaces technology), Circuits électriques, optiques et optoélectroniques, Electric, optical and optoelectronic circuits, Propriétés des circuits, Circuit properties, Circuits hyperfréquences, circuits intégrés hyperfréquences, lignes de transmission hyperfréquences, circuits à ondes submillimétriques, Microwave circuits, microwave integrated circuits, microwave transmission lines, submillimeter wave circuits, Antenne hyperfréquence, Microwave antenna, Antena hiperfrecuencia, Antenne UHF, UHF antennas, Antenne imprimée, Printed antenna, Antena imprimida, Aérosol, Aerosols, Aerosol, Caractéristique fonctionnement, Performance characteristic, Característica funcionamiento, Circuit intégré radiofréquence, Radiofrequency integrated circuits, Circuit intégré, Integrated circuit, Circuito integrado, Ecriture laser, Laser writing, Escritura láser, Electronique grand public, Consumer electronics, Evaluation performance, Performance evaluation, Evaluación prestación, Fabrication microélectronique, Microelectronic fabrication, Fabricación microeléctrica, Identification par radiofréquence, Radio frequency identification, Identificación por radiofrecuencia, Laser pulsé, Pulsed laser, Láser pulsado, Lithographie sans masque, Maskless lithography, Litografía sin máscara, Microusinage, Micromachining, Micromaquinado, Méthode itérative, Iterative method, Método iterativo, Optimisation, Optimization, Optimización, Prototypage rapide, Rapid prototyping, Prototipificación rápida, Résistivité couche, Sheet resistivity, Resistividad capa, Ecriture directe, Direct writing, Puce RFID, RFID tag, Antennas, printing, radio-frequency identification (RFID), and tags

Optimization of radio-frequency identification (RFID) tags often requires several iterations of antenna design/fabrication/testing to meet cost and performance targets. The use of a rapid prototyping approach for antenna development would allow the designer an inexpensive and fast route to the refinement process. In this study, the performance of a commercial-off-the-shelf ultrahigh frequency (UHF) etched copper antenna was compared to printed silver antennas prepared by the following three direct-write techniques: maskless mesoscale materials deposition; matrix-assisted pulsed laser evaporation direct-write; and, collimated aerosol beam direct-write. The morphologies of the antennas were analyzed using contact and optical profilers with sheet resistance also being measured. Operational characteristics were determined by mounting silicon integrated circuits (IC) to the four different types of antennas. The performance of tags that utilized direct-write silver antennas was comparable to the copper-based commercial tag. To our knowledge, this is the first demonstration where some of the direct-write rapid prototyping attributes (e.g., slight overspray, overlap of written lines, overall thickness less than 500 nm) are shown to not seriously impede RFID tag performance. These results demonstrate the utility of direct-write for rapid prototyping studies for UHF RFID antennas.

Telecommunications, Télécommunications, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Telecommunications et theorie de l'information, Telecommunications and information theory, Théorie de l'information, du signal et des communications, Information, signal and communications theory, Théorie du signal et des communications, Signal and communications theory, Signal, bruit, Signal, noise, Représentation du signal. Analyse spectrale, Signal representation. Spectral analysis, Détection, estimation, filtrage, égalisation, prédiction, Detection, estimation, filtering, equalization, prediction, Traitement du signal, Signal processing, Traitement des images, Image processing, Analyse composante principale, Principal component analysis, Análisis componente principal, Analyse discriminante, Discriminant analysis, Análisis discriminante, Classification automatique, Automatic classification, Clasificación automática, Classification image, Image classification, Classification signal, Signal classification, Distribution densité, Density distribution, Distribución densidad, Evaluation performance, Performance evaluation, Evaluación prestación, Extraction caractéristique, Feature extraction, Fonction densité, Density function, Función densidad, Fonction poids, Weight function, Función peso, Fonction répartition, Distribution function, Función distribución, Implémentation, Implementation, Implementación, Modèle 2 dimensions, Two dimensional model, Modelo 2 dimensiones, Méthode sous espace, Subspace method, Método subespacio, Méthode statistique, Statistical method, Método estadístico, Prototype, Prototipo, Qualité image, Image quality, Calidad imagen, Traitement image, Image processing, Procesamiento imagen, Traitement signal, Signal processing, Procesamiento señal, Transformation cosinus discrète, Discrete cosine transforms, Tumeur maligne, Malignant tumor, Tumor maligno, Chromosome classification, chromosome prototyping, discrete cosine transform (DCT), linear discriminant analysis (LDA), linear subspace, and principal component analysis (PCA)

Chromosomes are essential genomic information carriers. Chromosome classification constitutes an important part of routine clinical and cancer cytogenetics analysis. Cytogeneticists perform visual interpretation of banded chromosome images according to the diagrammatic models of various chromosome types known as the ideograms, which mimic artists' depiction of the chromosomes. In this paper, we present a subspace-based approach for automated prototyping and classification of chromosome images. We show that 1) prototype chromosome images can be quantitatively synthesized from a subspace to objectively represent the chromosome images of a given type or population, and 2) the transformation coefficients (or projected coordinate values of sample chromosomes) in the subspace can be utilized as the extracted feature measurements for classification purposes. We examine in particular the formation of three well-known subspaces, namely the ones derived from principal component analysis (PCA), Fisher's linear discriminant analysis, and the discrete cosine transform (DCT). These subspaces are implemented and evaluated for prototyping two-dimensional (2-D) images and for classification of both 2-D images and one-dimensional profiles of chromosomes. Experimental results show that previously unseen prototype chromosome images of high visual quality can be synthesized using the proposed subspace-based method, and that PCA and the DCT significantly outperform the well-known benchmark technique of weighted density distribution functions in classifying 2-D chromosome images.

Electronics, Electronique, Mechanics acoustics, Mécanique et acoustique, Physics, Physique, Sciences exactes et technologie, Exact sciences and technology, Physique, Physics, Generalites, General, Instruments, appareillage, composants et techniques communs à plusieurs branches de la physique et de l'astronomie, Instruments, apparatus, components and techniques common to several branches of physics and astronomy, Techniques, équipements et instruments mécaniques, Mechanical instruments, equipment and techniques, Systèmes et dispositifs micromécaniques, Micromechanical devices and systems, Domaines classiques de la physique (y compris les applications), Fundamental areas of phenomenology (including applications), Mécanique des fluides, Fluid dynamics, Mécanique des fluides appliquée, Applied fluid mechanics, Fluidique, Fluidics, Adhésif, Adhesives, Assemblage collé, Adhesive joint, Ensambladura pegada, Dispositif microélectromécanique, Microelectromechanical device, Dispositivo microelectromecánico, Dépôt électrolytique, Electrodeposition, Epaisseur couche, Layer thickness, Espesor capa, Fluidique, Fluidics, Microfluidique, Microfluidics, Microusinage, Micromachining, Modélisation, Modelling, Photolithographie, Photolithography, Pression hydrostatique, Hydrostatic pressure, Prototypage rapide, Rapid prototyping, Prototipificación rápida, Rapport aspect, Aspect ratio, Siloxane(diméthyl) polymère, Dimethylsiloxane polymer, Siloxano(dimetil) polímero, Laminate object manufacturing, layered microchannels, microelectromechanical devices, microfluidic structures, micromachining, and rapid-prototyping

This paper introduces xurography, or razor writing, as a novel rapid prototyping technique for creating microstructures in various films. This technique uses a cutting plotter traditionally used in the sign industry for cutting graphics in adhesive vinyl films. A cutting plotter with an addressable resolution of 10 μm was used to cut microstructures in various films with thicknesses ranging from 25 to 1000 μm. Positive features down to 35 μm and negative features down to 18 μm were cut in a 25 μm thick material. Higher aspect ratios of 5.2 for positive features and 8 for negative features were possible in a 360 μm thick material. A simple model correlating material properties to minimum feature size is introduced. Multilayered microstructures cut from pressure sensitive and thermal activated adhesive films were laminated in less than 30 min without photolithographic processes or chemicals. Potential applications of these microstructures are explored including: shadow masking, electroplating, micromolds for PDMS, and multilayered three-dimensional (3-D) channels. This inexpensive method can rapidly prototype microfluidic devices or tertiary fluid connections for higher resolution devices.

Electronics, Electronique, Computer science, Informatique, Telecommunications, Télécommunications, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Informatique; automatique theorique; systemes, Computer science; control theory; systems, Logiciel, Software, Systèmes informatiques et systèmes répartis. Interface utilisateur, Computer systems and distributed systems. User interface, Automatisation, Automation, Automatización, Calcul réparti, Distributed computing, Cálculo repartido, Chimie, Chemistry, Química, Elaboration logiciel, Software prototyping, Interface utilisateur, User interface, Interfase usuario, Processeur pipeline, Pipeline processor, Procesador oleoducto, Workflow, chemistry, distributed computing, pipeline processing, software, user interfaces, and workflow

Evolving technologies, as exemplified by computational grids and Web services, have made it possible to solve new scientific problems that would not have been feasible previously. In order to make such advances available to the community in general and to be able to solve new problems, not necessarily from the same discipline, it is imperative to build tools that provide a common user interface in order that application programmers and users do not have to be concerned with particulars of Web services and their underlying code, computational platforms, or with data file formats. We will describe our efforts in creating a Computational Chemistry Environment that encompasses a general scientific workflow environment, a domain specific example for quantum chemistry, our ongoing design of a workflow user interface, and our efforts at database integration.

Electrical engineering, Electrotechnique, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Electrotechnique. Electroenergetique, Electrical engineering. Electrical power engineering, Appareillage de connexion et de protection, Connection and protection apparatus, Electroénergétique, Electrical power engineering, Réseaux et lignes électriques, Power networks and lines, Divers, Miscellaneous, Courant court circuit, Short circuit currents, Courant défaut, Fault currents, Dispositif protection, Protective device, Dispositivo protección, Dispositif supraconducteur, Superconductor device, Dispositivo supraconductor, Distribution tension, Voltage distribution, Haute température, High temperature, Alta temperatura, Ligne électrique, Power transmission line, Línea eléctrica, Limiteur courant défaut, Fault current limiters, Moyenne tension, Medium voltage, Tensión media, Prototype, Prototipo, Prévention dommage, Damage prevention, Prevención daño, Réseau distribution, Distribution network, Red distribución, Réseau électrique, Electrical network, Red eléctrica, Supraconducteur haute température, High temperature superconductor, Supraconductor alta temperatura, Transport énergie électrique, Electric energy transportation, Transporte energía eléctrica, Fault current, fault current limiter (FCL), protection, short-circuit current, and superconductive FCL

The fault current limiter is considered a viable solution for reducing the fault current in the power line. In the U.S., great effort has been reported in academia and industry in developing such devices. However, demonstrating a fault current limiter in the live power grid is challenging not only technologically but regulatory. This paper reports a joint effort of academia, industry, and utility on prototyping and testing of saturable core high temperature superconductive fault current limiters (HTS FCLs). This device is the first fully operational HTS FCL installed on the commercial medium voltage distribution grid in the U.S.

Electrical engineering, Electrotechnique, Mechanical engineering, Génie mécanique, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Informatique; automatique theorique; systemes, Computer science; control theory; systems, Logiciel, Software, Systèmes informatiques et systèmes répartis. Interface utilisateur, Computer systems and distributed systems. User interface, Conception assistée, Computer aided design, Genie mecanique. Construction mecanique, Mechanical engineering. Machine design, Généralités, General, Affichage cristal liquide, Liquid crystal displays, Conception assistée, Computer aided design, Concepción asistida, Concordance forme, Pattern matching, Contrôle visuel, Visual control, Control visual, Internet, Masque photographique, Photographic mask, Máscara fotográfica, Prototypage rapide, Rapid prototyping, Prototipificación rápida, Supervision, Supervisión, Téléopération, Remote operation, Teleacción, Entreprise numérique, and Digital factory

Rapid prototyping (RP) can enhance design and manufacturing productivity by taking advantage of the Internet. Via the Internet, most small and medium size companies should be able to share the access of RP machine remotely without owning the expensive machines. This study combines RP preprocessing, RP machine, and the Internet into a telecontrolled manufacturing system. Also presented is the software and hardware for a new LCD-based photosensitive resin RP machine that uses only visible light. This visible light can expose and solidify an entire layer at once, layer-by-layer, until the whole part is finished. The user sends a three-dimensional (3-D) CAD model (STL file) via the Internet to a telecontrol server, which transforms the CAD model into a RP machine LCD photomask display. The user can then direct the RP machine to build the RP part while watching a live image of the part via the World Wide Web (WWW). An online visual system allows inspection of the RP part quality during manufacturing. Part building is monitored by a pattern matching algorithm which compares a grabbed image with the photomask. If the grabbed image is not adequately similar to the photomask, the program stops manufacture and notifies the user. The experimental results show that RP using the Internet is promised, but the surface roughness should be further improved.

Telecommunications, Télécommunications, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Electronique, Electronics, Matériel informatique, Hardware, Domotique, Home automation, Telecommunications et theorie de l'information, Telecommunications and information theory, Télécommunications, Telecommunications, Radiodiffusion. Vidéocommunications. Audiovisuel, Broadcasting. Videocommunications. Audiovisual, Coordination, Coordinación, Domotique, Home automation, Automatización doméstica, Informatique à domicile, Home computing, Interface utilisateur, User interface, Interfase usuario, Prototypage rapide, Rapid prototyping, Prototipificación rápida, Reconfiguration, Reconfiguración, Système exploitation, Operating system, and Sistema operativo

Computer science, Informatique, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Informatique; automatique theorique; systemes, Computer science; control theory; systems, Logiciel, Software, Génie logiciel, Software engineering, Développement logiciel, Software development, Desarrollo logicial, Génie logiciel, Software engineering, Ingeniería logiciel, Interface utilisateur, User interface, Interfase usuario, Pilote, Pilot, Prototype, Prototipo, Stratégie, Strategy, Estrategia, Evolutionary software development, Horizontal prototyping, and Vertical prototyping

Prototyping, a method and technique frequently used in many engineering disciplines, has been adopted as a technique in software engineering to improve the calculation of new projects involving risks. However, there has so far been a lack of documented experience with the use of prototyping in industrial software production. The present work tries to close this gap. First, we introduce central prototyping concepts and terminology. In the subsequent section we present five industrial software projects in which explicit use was made of prototyping. Based on our analysis of these projects we present the resulting conclusions: prototyping means more than rapidly developing user interfaces; prototyping is a central part of a development strategy; prototyping means end user involvement; finding the right mixture of prototypes improves the development process.