PRODUCT life cycle, NEW product development, TIME to market (New products), CONCURRENT engineering, and RAPID prototyping
The article offers information on product life cycle management (PLM). The author states that the pressure of delivering new, more innovative, quality products to the market, at the shortest time, is promoting PLM throughout all industries. Furthermore, he highlights the importance of using product development tools and concurrent engineering philosophy.
MANUFACTURING processes, PROTOTYPES, NEW product development, COST effectiveness, and ENGINEERING
The article presents information on advanced thermal management by Metal Matrix Cast Composites Inc. Engineers can now tailor their thermal-management packaging, and interconnection needs with a low-cost, metal-matrix composite material made of aluminum, silicon, and carbon (AlSiC). The material's isotropic thermal coefficient of expansion (CTE), which includes 8.75, 10.56, and 11.7 for AlSiC-9, -10, and -11, respectively (from 30°C to 200°C), can be adjusted for specific applications by modifying the aluminum-metal/SiC ratio. This eliminates the need for thermal interface stacking, increasing field reliability. The AlSiC composite's near and netshaped fabrication process produces the composite material and fabricates the product's geometry. This results in a cost-effective product and enables rapid prototyping for high-volume advanced thermal management. Its unique casting process permits the integration of very high thermal-conductivity inserts over 1000 W/mK or cooling tubes for more advanced thermal management. According to CPS, because the performance of the material varies greatly depending on how it's customized, prices can range from $5 to $30 per unit.
AUTOMATION, INDUSTRIAL engineering, NEW product development, and ELECTRONICS
Several electronic design automation-related news reports, gathered as of April 12, 2004, are presented. The three-dimensional parasitic extraction technology enters the next generation in the Q3D Extractor v.6 of the Ansoft company. The tool speeds design of critical nets and interconnect components in integrated circuit packages, on personal computer boards, and in the connection path between them. It serves well in applications where on-chip passives like spirals, vias, meanders, and interdigitated capacitors must be designed and optimized up front to achieve timing closure. Two evaluation and prototyping boards are now available with high-performance field-programmable gate arrays and a wide range of options from the Celoxica company.