MERGERS & acquisitions, ELECTRONIC packaging, and INTEGRATED circuits industry
The article reports on the merger between CV Inc., Business Solutions Inc., FIB-X, Microtech Analytical Labs LP and Fast Semiconductor Inc. in the U.S. The merger has resulted to the creation of a full-scale prototyping house for chipscale, flip chip, BGA and QFN packages, along with bumping and wire-bonding, assembly, failure analysis, design debug and packaging services. CV CEO Terrence Q. Collier believes that the merger will develop a comprehensive prototyping facility.
PROTOTYPES, COMPUTER software, SYSTEMS design, OPTICAL industry, COMPUTER simulation, and OPTICAL computers
Presents information on the combination of design-and-simulation tools and measurement equipment that could create virtual models of network performance as affected by optical components. Advantages of virtual prototyping; Discussion on the goal of network simulation; Recommendation on the use of an accurate component measurement simulation system.
PACKAGING industry, EXECUTIVES, and BUSINESS forecasting
The article presents the views of several executives about the prospect for the package goods industry for the year 2006 in the U.S. Don Naugler of VJ Electronix hopes that 2006 will be the year for refinement, focusing on efficiencies, and offer more power top heaters. Michael C. Shore of Texas Prototypes Inc. claims that for the year 2006, they will offer advanced packaging services for quick-turn design and prototyping of multi-chip modules.
ELECTRONIC industries equipment, INDUSTRIAL equipment, and MACHINERY
Evaluates several manufacturing equipment and tools for the electronics industry. E4/100 Energy Chain cable carriers from Igus; ELECTROVERT Quick Change solder pot from Speedline Technologies; Process Development and Prototyping Services fiber alignment equipment from Palomar Technologies; SmartScope Quest 650 multi-sensor metrology system from Optical Gaging Products.
Reports on the business alliance of Palomar Technologies and Sonix Inc. to help component manufacturers improve yield and reduce assembly costs. Background on Palomar's Process Development and Prototyping Services.
INDUSTRIAL procurement, INDUSTRIAL equipment, and PACKAGING machinery industry
Reports on the acquisition of the wire bonding and gold ball bumping equipment of Palomar Technologies Corp. by NxGen Electronics Inc., an advanced microelectronics design, manufacturing, packaging and custom assembly in San Diego, California. Advantage of the equipment in allowing NxGen to perform expanded quick-turn prototyping and complex assembly packaging processes; Plan to incorporate its existing machines with the new equipment; Production capacity of the new packaging machinery.
COMPUTER industry, ORIGINAL equipment manufacturers, INDUSTRIAL procurement, CONTRACTING out, and PRODUCTION engineering
Discusses the options available for original equipment manufacturer to get their products to market on time. Maintaining research and development, design, production and testing in-house; Purchasing of specialized automated equipment; Outsourcing product development, prototyping, supply chain management and volume manufacturing.