PACKAGING research, TECHNOLOGY, and VALUE added (Marketing)
The Packaging Research Center (PRC) at the Georgia Institute of Technology has a mission it believes will revolutionize the convergent and microminiaturized systems of tomorrow. At their June 16 open house, several center directors, professors and graduate students spent a full day educating attendees on the vision that is system-on-a-package (SOP) through tours and breakout sessions. Instead of the bulky "system" boxes of the past that may have housed hundreds of components performing just one task, an SOP system performs computing, communication, consumer and other functions in a small, single system package. As one audience member commented, however, semiconductor companies are starting to see packaging, and not just silicon, as a value-add for customers. Supporting companies include IBM, HP, Nokia Corp., Sony Corp. and Motorola Inc., who are part of the larger network of 50 global companies who are involved in the center's research from SOP to flip chip to wafer-level packaging. In addition, the PRC has prototyping facilities, fundamental research laboratories across the' Georgia Tech campus and a class 1000 clean room to aid its research activity and technology transfers for PRC members.
Reports the provision of electronics manufacturing services by Vitel Technologies Inc. in Norcross, Georgia. Company background; Details on the manufacturing facility of Vitel; Ability of the company to handle complex assemblies; Offer of prototyping and product introduction services.