The article reports on the launch of Palomar Microelectronics, the microelectronics packaging services division of Palomar Technologies. The parent company, which also manufactures wire bonding and placement equipment, formed the group to meet the demand for quickturn product development, prototyping, test and assembly services. Palomar Microelectronics has advanced technologies for wire bonding, gold ball bumping and precision component placement for semiconductor packages, optoelectronic and other packages.
ELECTRONIC industries, OPTOELECTRONICS, MICROELECTROMECHANICAL systems, and RADIO frequency
Stamford, Connecticut-based FeinFocus USA Inc. and Vista, California-based Palomar Technologies Corp. have teamed to address the manufacturing challenges of optoelectronics, microelectromechanical systems/micro-optoelectromechanical systems and radio frequency components markets. Palomar's Process Development and Prototyping Services will use the Feinfocus FOX-160.25MFT x-ray inspection system for the inspection of advanced components, materials and packaging technologies. These companies will also publish joint technical papers on their findings with regards to process development, testing and manufacturing of optoelectronics and micro-mechanical components and assemblies.