USB (Computer bus) and COMPLEMENTARY metal oxide semiconductors
Deals with the approach taken at Bell Labs to implement the USB 2.0 technology for its product development. Use of the complementary metal oxide semiconductors (CMOS) technology; Options available for integrated solutions; Discoveries during the prototyping phase.
WIRELESS communications, SEMICONDUCTOR wafers, COMPLEMENTARY metal oxide semiconductors, RADIO frequency, and FERROELECTRIC RAM
This article reports on the plans announced by Freescale Semiconductor to move to 64nm prototyping, one year after its 90nm production start. Since initiating manufacturing of 90nm product designs on 300mm wafers in October 2004, Freescale has introduced 12 new products on 90nm low-power CMOS technology. The products include digital, analog, radio frequency and embedded memory devices for various end applications, such as wireless handsets, printers, enterprise networking components and wireless infrastructure equipment.
INDUSTRIAL electronics, NEW product development, RAPID prototyping, POWER amplifiers, and COMPLEMENTARY metal oxide semiconductors
This article presents information about several newly introduced industrial products, equipments, and technologically updated software. The first product, considered here, is the FMS6407, a triple video driver, designed by Fairchild Semiconductor Corp. as the industry's only triple video driver that combines flexibility with sixth-order filtering, high-definition, progressive scan, and standard-definition filters in one chip. Agilent Technologies Inc.'s SDNB-6021, reportedly, is claimed to be the world's first navigation sensor for the computer mouse. This new product is designed to dramatically increase the number of surfaces that can be navigated by the mouse, providing 20 times the surface tracking power of a LED-based optical mouse. Silicon Laboratories Inc. has recently launched its new power amplifier, Si4300, which is designed as the industry's first CMOS power amplifier for GSM/GPRS cellular handsets and the first to be integrated into a monolithic die.