A computer-implemented method, computer program product and prototyping platform creates a design blueprint for a substrate-based microfluidic device. A design and prototyping platform receives at least one blueprint parameter and at least one constraint associated with a proposed substrate-based microfluidic device including a hydrophilic material and arrangement of a pattern of a hydrophobic material. The platform determines an arrangement of a plurality of microfluidic device elements as candidates for implementation of the proposed substrate-based microfluidic device and outputs a design blueprint of the proposed substrate-based microfluidic device.
The disclosure describes methods and apparatus for quickly prototyping of a solution developed using one or more sensing devices (e.g., sensors), functional blocks, algorithm libraries, and customized logic. The methods produce firmware executable by a processor (e.g., a microcontroller) on an embedded device such as a development board, expansion board, or the like. By performing these methods on the apparatus described, a user is able to create a function prototype without having deep knowledge of the particular sensing device or any particular programming language. Prototypes developed as described herein enable the user to rapidly test ideas and develop sensing device proofs-of-concept. The solutions produced by the methods and apparatus improve the functioning of the sensor being prototyped and the operation of the embedded device where the sensor is integrated.
A method for manufacturing an electro-mechanical device includes creating a plurality of substrates using a first additive manufacturing process. Each of the substrates includes a polymeric material. The substrates include a first substrate and a second substrate. The first substrate includes a first main body and defines a protrusion extending from the first main body. The second substrate includes a second main body and a recess defined in the second main body. The method includes coupling the first substrate to the second substrate by inserting the protrusion into the recess such that the protrusion elastically deforms to an elastically averaged configuration. The protrusion and the recess together form an elastic averaging coupling. The method includes creating a plurality of electrically conductive components using a second additive manufacturing process and then coupling the electrically conductive components to at least one of the substrates.
Apparatus for producing a three-dimensional model by sequentially forming layers of photopolymer material one on top of the other responsive to data defining the three-dimensional model is disclosed. The apparatus includes at least one printing head configured to dispense the photopolymer material, an array of LEDs controllable to provide radiation to polymerize the photopolymer material and a controller. The controller is configured to control the at least one printing head to dispense the photopolymer material to sequentially form the layers of material. The controller is also configured to turn on the array of LEDs to provide the radiation to cure the photopolymer material when situated above the model and to turn off the array of LEDs when not situated above the model.
A chip-to-chip integration process for rapid prototyping of silicon avalanche photodiode (APD) arrays has been developed. This process has several advantages over wafer-level 3D integration, including: (1) reduced cost per development cycle since a dedicated full-wafer read-out integrated circuit (ROIC) fabrication is not needed, (2) compatibility with ROICs made in previous fabrication runs, and (3) accelerated schedule. The process provides several advantages over previous processes for chip-to-chip integration, including: (1) shorter processing time as the chips can be diced, bump-bonded, and then thinned at the chip-level faster than in a wafer-level back-illumination process, and (2) the CMOS substrate provides mechanical support for the APD device, allowing integration of fast microlenses directly on the APD back surface. This approach yields APDs with low dark count rates (DCRs) and higher radiation tolerance for harsh environments and can be extended to large arrays of APDs.