Electromigration at gold-aluminium interfaces and in thin aluminium tracks
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All available sources
- Authors:
- VANHECKE, B
DE SCHEPPER, L
DE CEUNINCK, W
D'HAEGER, V
D'OLIESLAEGER, M
BEYNE, E
STALS, L
ROGGEN, J - Author Affiliations:
- IMEC, materials packaging div., 3001 Leuven, Belgium
- Source:
- Quality and reliability of electronic devicesQuality and reliability engineering international. 8(3):253-258
- Publication Date:
- 1992-01-01
- Language:
- English
- Notes:
- Electronics
- Subjects:
- Control theory, operational research
Automatique, recherche opérationnelle
Sciences exactes et technologie
Exact sciences and technology
Sciences appliquees
Applied sciences
Electronique
Electronics
Electronique des semiconducteurs. Microélectronique. Optoélectronique. Dispositifs à l'état solide
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Circuits intégrés
Integrated circuits
Conception. Technologies. Analyse fonctionnement. Essais
Design. Technologies. Operation analysis. Testing
Aluminium
Bille
Caractéristique temporelle
Circuit intégré
Contact métal métal
Contrainte thermique
Electrodiffusion
Essai vieillissement accéléré
In situ
Interconnexion
Mesure
Or
Résistance contact - Format:
- Academic Journal
- Database:
- PASCAL Archive
- Journal:
- Quality and reliability of electronic devices
- Volume:
- 8
- Issue:
- 3
- Page Start:
- 253
- Page Count:
- 6
- ISSN:
- 07488017
- Publisher:
- Chichester: Wiley, 1992.
- Document Type:
- Article
- Physical Description:
- print, 4 ref
