Electromigration: investigation of heterogeneous systems
Best source
All available sources
- Authors:
- VANHECKE, B
DE SCHEPPER, L
DE CEUNINCK, W
D'HAEGER, V
D'OLIESLAEGERS, M
BEYNE, E
ROGGEN, J
STALS, L - Author Affiliations:
- IMEC, materials packaging div., 3001 Leuven, Belgium
- Source:
- Microelectronics and reliability. 33(8):1141-1157
- Publication Date:
- 1993-01-01
- Language:
- English
- Notes:
- Electronics
- Subjects:
- Electronics
Electronique
Sciences exactes et technologie
Exact sciences and technology
Sciences appliquees
Applied sciences
Electronique
Electronics
Electronique des semiconducteurs. Microélectronique. Optoélectronique. Dispositifs à l'état solide
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Circuits intégrés
Integrated circuits
Conception. Technologies. Analyse fonctionnement. Essais
Design. Technologies. Operation analysis. Testing
Aluminium
Aluminio
Circuit intégré
Integrated circuit
Circuito integrado
Electrodiffusion
Electrodifusión
Encapsulation
Encapsulación
Etude expérimentale
Experimental study
Estudio experimental
Fiabilité
Reliability
Fiabilidad
Interconnexion
Interconnection
Interconección
Métallisation
Metallizing
Metalización
Or
Gold
Oro
Phénomène transport
Transport process
Fenómeno transporte - Format:
- Academic Journal
- Database:
- PASCAL Archive
- Journal:
- Microelectronics and reliability
- Volume:
- 33
- Issue:
- 8
- Page Start:
- 1141
- Page Count:
- 17
- ISSN:
- 00262714
- Publisher:
- Oxford: Elsevier, 1993.
- Document Type:
- Article
- Physical Description:
- print, 9 ref
