The Libraries are resuming limited in-person research activities by appointment only as part of the University's Research Restart Plan.
Learn more about the Libraries' entry requirements and available services.

If you can’t find a digital version of an item you need in SearchWorks or HathiTrust, we’ll do our best to buy it. Request a digital item.

Three-Dimensional Thermomechanical Simulation of Fine-Pitch High-Count Ball Grid Array Flip-Chip Assemblies : MECHANICAL RELIABILITY OF ELECTRONIC COMPONENTS