Surface iodination: A simple and efficient protocol to improve the isotropically thermal conductivity of silver-epoxy pastes
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- Authors:
- HAOYI WU
SUMWAI CHIANG
WEI HAN
YOUHONG TANG
FEIYU KANG
CHENG YANG - Author Affiliations:
- Division of Energy and Environment, Graduate School at Shenzhen, Tsinghua University, Xili University Town, Nanshan, Shenzhen City, Guangdong Province 518055, China
Centre for NanoScale Science and Technology, School of Computer Science, Engineering and Mathematics, Flinders University, Adelaide 5042, Australia - Source:
- Composites science and technology. 99:109-116
- Publication Date:
- 2014-01-01
- Language:
- English
- Abstract:
- Heat dissipation is a critical issue in many areas such as the high-performance electronic devices. The present work gives a detailed investigation regarding a simple and efficient surface modification method, which can remarkably improve the thermal conductivity of the isotropically thermally conductive adhesives (TCAs). Herein we demonstrate that the thermal conductivity of TCAs based on micron-sized silver fillers can be improved to near eightfold merely through simple surface chemistry treatment of the fillers, without changing the conventional epoxy resin (adhesive) processing conditions. Experimental results show that the thermal conductivity of a TCA sample with iodine modified silver fillers (85 wt%, size 1-2 μm. near-spherical particles) achieved 13.5 Wm-1 K-1 when cured at 150 °C. Compared to the unmodified silver-based TCAs, only 1.7 Wm-1 K-1 was achieved when cured in the same condition. This work suggests that through modulating the filler interface of a TCA, the thermal conductivity of a TCA can be drastically improved. These TCAs with superior isotropic thermal conductivity may find many heat dissipation applications e.g. surface mounted devices (SMDs) and high power (printed circuit) motherboards.
- Notes:
- Electronics<br><br>Polymer industry, paints, wood
- Subjects:
- Chemical industry parachemical industry
Industrie chimique et parachimique
Mechanics acoustics
Mécanique et acoustique
Metallurgy, welding
Métallurgie, soudage
Polymers, paint and wood industries
Polymères, industries des peintures et bois
Sciences exactes et technologie
Exact sciences and technology
Sciences appliquees
Applied sciences
Electronique
Electronics
Electronique des semiconducteurs. Microélectronique. Optoélectronique. Dispositifs à l'état solide
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Fabrication microélectronique (technologie des matériaux et des surfaces)
Microelectronic fabrication (materials and surfaces technology)
Industrie des polymeres, peintures, bois
Polymer industry, paints, wood
Technologie des polymères
Technology of polymers
Formes d'application et semiproduits
Forms of application and semi-finished materials
Matériaux composites
Composites
Domaines d'application
Application fields
Adhésif
Adhesive
Adhesivo
Argent
Silver
Plata
Conductivité thermique
Thermal conductivity
Conductividad térmica
Epoxyde résine
Epoxy resin
Epóxido resina
Etude expérimentale
Experimental study
Estudio experimental
Fabrication microélectronique
Microelectronic fabrication
Fabricación microeléctrica
Iode
Iodine
Iodo
Matériau composite
Composite material
Material compuesto
Microparticule
Microparticle
Micropartícula
Morphologie
Morphology
Morfología
Particule métallique
Metal particle
Partícula metálica
Particule sphérique
Spherical particle
Partícula esférica
Propriété thermique
Thermal properties
Propiedad térmica
Traitement chimique
Chemical treatment
Tratamiento químico
Traitement surface
Surface treatment
Tratamiento superficie
Adhésif conducteur
A. Polymer―matrix composites (PMCs)
B. Thermal properties
D. Scanning electron microscopy (SEM) - Format:
- Academic Journal
- Database:
- PASCAL Archive
- Journal:
- Composites science and technology
- Volume:
- 99
- Page Start:
- 109
- Page Count:
- 8
- ISSN:
- 02663538
- Publisher:
- Kidlington: Elsevier, 2014.
- Document Type:
- Article
- Physical Description:
- print, 32 ref
