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Green Library
Status of items at Green Library
Green Library Status
Social Sciences Resource Center Find it
HE310 .S36 A56 In-library use

2. Hallim pŏphak = Forum [ - 2019]

Journal/Periodical
v. ; 25 cm.
Journal/Periodical
v. ; 28 cm.
Business Library, SAL3 (off-campus storage)
Status of items at Business Library
Business Library Status
Stacks
GV174 .M55 2012/13 Unknown
GV174 .M55 2010 Unknown
Status of items at SAL3 (off-campus storage)
SAL3 (off-campus storage) Status
Stacks Request
GV174 .M55 2008 Available
Journal/Periodical
1 online resource
Book
1 online resource (ii, 2 unnumbered pages, 53 pages) : color illustrations.
Book
online resource
  • General dilution charts
  • Format and content of intravenous medications
  • Key to abbreviations
  • Important IV therapy facts
  • Resources
  • IV drugs
  • Appendix A: Recommendations for the safe use and handling of cytotoxic drugs
  • Appendix B: FDA pregnancy categories)
  • Appendix C: U.S. Department of Health and Human Services, National Institutes of Health, National Cancer Institute Common Terminology Criteria for adverse events (CTCAE)
  • Appendix D: Information for patients receiving immunosuppressive agents
  • Appendix E: Recently approved drugs
  • Solution compatibility chart.
  • General dilution charts
  • Format and content of intravenous medications
  • Key to abbreviations
  • Important IV therapy facts
  • Resources
  • IV drugs
  • Appendix A: Recommendations for the safe use and handling of cytotoxic drugs
  • Appendix B: FDA pregnancy categories)
  • Appendix C: U.S. Department of Health and Human Services, National Institutes of Health, National Cancer Institute Common Terminology Criteria for adverse events (CTCAE)
  • Appendix D: Information for patients receiving immunosuppressive agents
  • Appendix E: Recently approved drugs
  • Solution compatibility chart.
Medical Library (Lane)
Status of items at Medical Library (Lane)
Medical Library (Lane) Status
Check Lane Library catalog for status
CLINICALKEY Unknown
Book
1 online resource : illustrations (some color)
Book
1 online resource (xxii, 458 pages) : illustrations, figures, tables ; 25 cm
  • A. About the Author
  • B. Preface
  • C. Acknowledgments
  • 1. 3D Integration for Semiconductor IC Packaging
  • Introduction
  • 3D Integration
  • 3D IC Packaging
  • 3D Si Integration
  • 3D IC Integration
  • Supply Chains before the TSV Era
  • Supply Chains for the TSV Era—Who Makes the TSV?
  • Supply Chains for the TSV Era—Who Does the MEOL, Assembly, and Test?
  • CMOS Images Sensors with TSVs
  • MEMS with TSVs
  • References
  • 2. Through-Silicon Vias Modeling and Testing
  • Introduction
  • Electrical Modeling of TSVs
  • Thermal Modeling of TSVs
  • Mechanical Modeling and Testing of TSVs
  • References
  • 3. Stress Sensors for Thin-Wafer Handling and Strength Measurement
  • Introduction
  • Design and Fabrication of Piezoresistive Stress Sensors
  • Application of Stress Sensors in Thin-Wafer Handling
  • Application of Stress Sensors in Wafer Bumping
  • Application of Stress Sensors in Drop Test of Embedded Ultrathin Chips
  • References
  • 4. Package Substrate Technologies
  • Introduction
  • Package Substrate with Build-up Layers for Flip Chip 3D IC Integration
  • Coreless Package Substrates
  • Recent Advance of Package Substrate with Build-up Layer
  • References
  • 5. Microbumps: Fabrication, Assembly, and Reliability
  • Introduction
  • Fabrication, Assembly, and Reliability of 25-μm-Pitch Microbumps
  • Fabrication, Assembly, and Reliability of 20-μm-Pitch Microbumps
  • Fabrication, Assembly, and Reliability of 15-μm-Pitch Microbumps
  • References
  • 6. 3D Si Integration
  • Introduction
  • The Electronic Industry
  • Moore's Law and More-Than-Moore
  • The Origin of 3D Integration
  • Overview and Outlook of 3D Si Integration
  • 3D Si Integration Technology Challenges
  • 3D Si Integration EDA Challenges
  • Summary and Recommendations
  • References
  • 7. 2.5D/3D IC Integration
  • Introduction
  • TSV Process for 3D IC Integration
  • The Potential Application of 3D IC Integration
  • Memory-Chip Stacking
  • Wide I/O Memory or Logic-on-Logic
  • Wide I/O DRAM or Hybrid Memory Cube
  • Wide I/O 2 and High Bandwidth Memory
  • Wide I/O Interface (2.5D IC Integration)
  • Thin-Wafer Handling
  • References
  • 8. 3D IC Integration with Passive Interposer
  • Introduction.
  • 3D IC Integration with TSV/RDL Interposer
  • TSV/RDL Interposer with Double-Sided Chip Attachments
  • TSV Interposer with Chips on Both Sides
  • Low-Cost TSH Interposer for 3D IC Integration
  • References
  • 9. Thermal Management of 2.5D/3D IC Integration
  • Introduction
  • Design Philosophy
  • The New Design
  • Equivalent Model for Thermal Analysis
  • Interposer with Chip/Heat Spreader on Its Top Side and Chip on Its Bottom Side
  • Interposer with Chip/Heat Spreader on Its Top Side and Chip/Heat Slug on Its Bottom Side
  • Interposer with Four Chips on Its Top Side with Heat Spreader
  • Thermal Performance between 2.5D and 3D IC Integrations
  • Thermal Management System with TSV Interposers with Embedded Microchannels
  • References
  • 10. Embedded 3D Hybrid Integration
  • Introduction
  • Trends of Optoelectronic Products
  • The Old Design—High-Frequency Data Link on PCB Using Optical Waveguides
  • The Old Design—Embedded Board-Level Optical Interconnects
  • The New Designs
  • An Embedded 3D Hybrid Integration Design Example
  • Semi-Embedded TSV Interposer with Stress Relief Gap
  • References
  • 11. 3D LED and IC Integration
  • Introduction
  • Status and Outlook of Haitz's Law
  • LED Has Come a Long Way!
  • Four Key Segments of LED Products
  • 3D LED and IC Integration
  • 2.5D IC and LED Integration
  • Thermal Management of 3D LED and IC Integration
  • References
  • 12. 3D MEMS and IC Integration
  • Introduction
  • MEMS Packaging
  • Design of 3D MEMS and IC Integration
  • Assembly Process of 3D MEMS and IC Integration
  • Low-Temperature Bonding of 3D MEMS Packaging with Solders
  • Recent Developments in Advanced MEMS Packaging
  • References
  • 13. 3D CMOS Image Sensor and IC Integration
  • Introduction
  • FI-CIS and BI-CIS
  • 3D CIS and IC Stacking
  • 3D CIS and IC Integration
  • Summary and Recommendations
  • References
  • 14. 3D IC Packaging
  • Introduction
  • Chip Stacking by Wirebonding
  • Package-on-Package (PoP)
  • Wafer-Level Packaging
  • Fan-Out eWLP
  • Embedded Panel-Level Packaging
  • Summary and Recommendations
  • References.
A comprehensive guide to 3D IC integration and packaging methods and solutions, featuring detailed examples and real-world applications Semiconductor manufacturers are continuously seeking new paths to design and fabricate ICs with increased density, higher bandwidth, and lower power. Many design teams are now looking to 3D IC integration as an enabling technology for the development of the next generation of semiconductors. Based on a popular course developed by its author, 3D IC Integration and Packaging is written so that you can quickly acquire problem-solving skills and understand the trade-offs inherent in making system-level decisions. Provides cutting-edge, timely information on all aspects of 3D IC integration and packaging Advanced topics include TSV, thin-wafer handling, thermal management, and solder microbumping Practical applications of 3D IC technology are covered in full detail Author has written 16 engineering books and published more than 350 peer-reviewed papers.
(source: Nielsen Book Data)
  • A. About the Author
  • B. Preface
  • C. Acknowledgments
  • 1. 3D Integration for Semiconductor IC Packaging
  • Introduction
  • 3D Integration
  • 3D IC Packaging
  • 3D Si Integration
  • 3D IC Integration
  • Supply Chains before the TSV Era
  • Supply Chains for the TSV Era—Who Makes the TSV?
  • Supply Chains for the TSV Era—Who Does the MEOL, Assembly, and Test?
  • CMOS Images Sensors with TSVs
  • MEMS with TSVs
  • References
  • 2. Through-Silicon Vias Modeling and Testing
  • Introduction
  • Electrical Modeling of TSVs
  • Thermal Modeling of TSVs
  • Mechanical Modeling and Testing of TSVs
  • References
  • 3. Stress Sensors for Thin-Wafer Handling and Strength Measurement
  • Introduction
  • Design and Fabrication of Piezoresistive Stress Sensors
  • Application of Stress Sensors in Thin-Wafer Handling
  • Application of Stress Sensors in Wafer Bumping
  • Application of Stress Sensors in Drop Test of Embedded Ultrathin Chips
  • References
  • 4. Package Substrate Technologies
  • Introduction
  • Package Substrate with Build-up Layers for Flip Chip 3D IC Integration
  • Coreless Package Substrates
  • Recent Advance of Package Substrate with Build-up Layer
  • References
  • 5. Microbumps: Fabrication, Assembly, and Reliability
  • Introduction
  • Fabrication, Assembly, and Reliability of 25-μm-Pitch Microbumps
  • Fabrication, Assembly, and Reliability of 20-μm-Pitch Microbumps
  • Fabrication, Assembly, and Reliability of 15-μm-Pitch Microbumps
  • References
  • 6. 3D Si Integration
  • Introduction
  • The Electronic Industry
  • Moore's Law and More-Than-Moore
  • The Origin of 3D Integration
  • Overview and Outlook of 3D Si Integration
  • 3D Si Integration Technology Challenges
  • 3D Si Integration EDA Challenges
  • Summary and Recommendations
  • References
  • 7. 2.5D/3D IC Integration
  • Introduction
  • TSV Process for 3D IC Integration
  • The Potential Application of 3D IC Integration
  • Memory-Chip Stacking
  • Wide I/O Memory or Logic-on-Logic
  • Wide I/O DRAM or Hybrid Memory Cube
  • Wide I/O 2 and High Bandwidth Memory
  • Wide I/O Interface (2.5D IC Integration)
  • Thin-Wafer Handling
  • References
  • 8. 3D IC Integration with Passive Interposer
  • Introduction.
  • 3D IC Integration with TSV/RDL Interposer
  • TSV/RDL Interposer with Double-Sided Chip Attachments
  • TSV Interposer with Chips on Both Sides
  • Low-Cost TSH Interposer for 3D IC Integration
  • References
  • 9. Thermal Management of 2.5D/3D IC Integration
  • Introduction
  • Design Philosophy
  • The New Design
  • Equivalent Model for Thermal Analysis
  • Interposer with Chip/Heat Spreader on Its Top Side and Chip on Its Bottom Side
  • Interposer with Chip/Heat Spreader on Its Top Side and Chip/Heat Slug on Its Bottom Side
  • Interposer with Four Chips on Its Top Side with Heat Spreader
  • Thermal Performance between 2.5D and 3D IC Integrations
  • Thermal Management System with TSV Interposers with Embedded Microchannels
  • References
  • 10. Embedded 3D Hybrid Integration
  • Introduction
  • Trends of Optoelectronic Products
  • The Old Design—High-Frequency Data Link on PCB Using Optical Waveguides
  • The Old Design—Embedded Board-Level Optical Interconnects
  • The New Designs
  • An Embedded 3D Hybrid Integration Design Example
  • Semi-Embedded TSV Interposer with Stress Relief Gap
  • References
  • 11. 3D LED and IC Integration
  • Introduction
  • Status and Outlook of Haitz's Law
  • LED Has Come a Long Way!
  • Four Key Segments of LED Products
  • 3D LED and IC Integration
  • 2.5D IC and LED Integration
  • Thermal Management of 3D LED and IC Integration
  • References
  • 12. 3D MEMS and IC Integration
  • Introduction
  • MEMS Packaging
  • Design of 3D MEMS and IC Integration
  • Assembly Process of 3D MEMS and IC Integration
  • Low-Temperature Bonding of 3D MEMS Packaging with Solders
  • Recent Developments in Advanced MEMS Packaging
  • References
  • 13. 3D CMOS Image Sensor and IC Integration
  • Introduction
  • FI-CIS and BI-CIS
  • 3D CIS and IC Stacking
  • 3D CIS and IC Integration
  • Summary and Recommendations
  • References
  • 14. 3D IC Packaging
  • Introduction
  • Chip Stacking by Wirebonding
  • Package-on-Package (PoP)
  • Wafer-Level Packaging
  • Fan-Out eWLP
  • Embedded Panel-Level Packaging
  • Summary and Recommendations
  • References.
A comprehensive guide to 3D IC integration and packaging methods and solutions, featuring detailed examples and real-world applications Semiconductor manufacturers are continuously seeking new paths to design and fabricate ICs with increased density, higher bandwidth, and lower power. Many design teams are now looking to 3D IC integration as an enabling technology for the development of the next generation of semiconductors. Based on a popular course developed by its author, 3D IC Integration and Packaging is written so that you can quickly acquire problem-solving skills and understand the trade-offs inherent in making system-level decisions. Provides cutting-edge, timely information on all aspects of 3D IC integration and packaging Advanced topics include TSV, thin-wafer handling, thermal management, and solder microbumping Practical applications of 3D IC technology are covered in full detail Author has written 16 engineering books and published more than 350 peer-reviewed papers.
(source: Nielsen Book Data)
Journal/Periodical
online resource
Medical Library (Lane)
Status of items at Medical Library (Lane)
Medical Library (Lane) Status
Check Lane Library catalog for status
SPRINGER Unknown
Book
1 online resource : illustrations (black and white)
This volume addresses the nature of first-personal, or de se, thought. Many have held that first-person thought motivates a revision of traditional accounts of content and how it is accessed, but this raises puzzling questions about how we are able to communicate such thoughts. It is these questions that are answered here.
This volume addresses the nature of first-personal, or de se, thought. Many have held that first-person thought motivates a revision of traditional accounts of content and how it is accessed, but this raises puzzling questions about how we are able to communicate such thoughts. It is these questions that are answered here.
Book
online resource (xvii, 534 pages) : color illustrations
Medical Library (Lane)
Status of items at Medical Library (Lane)
Medical Library (Lane) Status
Check Lane Library catalog for status
SPRINGER Unknown
Book
1 online resource (xx, 523 pages)
Book
1 online resource.
Advanced District Heating and Cooling (DHC) Systems presents the latest information on the topic, providing valuable information on the distribution of centrally generated heat or cold energy to buildings, usually in the form of space heating, cooling, and hot water. As DHC systems are more efficient and less polluting than individual domestic or commercial heating and cooling systems, the book provides an introduction to DHC, including its potential contribution to reducing carbon dioxide emissions, then reviews thermal energy generation for DHC, including fossil fuel-based technologies, those based on renewables, and surplus heat valorization. Final sections address methods to improve the efficiency of DHC.
Advanced District Heating and Cooling (DHC) Systems presents the latest information on the topic, providing valuable information on the distribution of centrally generated heat or cold energy to buildings, usually in the form of space heating, cooling, and hot water. As DHC systems are more efficient and less polluting than individual domestic or commercial heating and cooling systems, the book provides an introduction to DHC, including its potential contribution to reducing carbon dioxide emissions, then reviews thermal energy generation for DHC, including fossil fuel-based technologies, those based on renewables, and surplus heat valorization. Final sections address methods to improve the efficiency of DHC.
Book
online resource (vii, 165 pages) : illustrations
  • Toward automation of insulin delivery : management solutions for type 1 diabetes / Nimri, R., Phillip, M.
  • Islet transplantation in pediatric patients : current indications and future perspectives / Bertuzzi, F., Antonioli, B., Tosca, M.C., Galuzzi, M., Bonomo, M., Marazzi, M., Colussi, G
  • Glucagon-like peptide-1 receptor agonist treatment for pediatric obesity / Kelly, A.S
  • Docosahexaenoic acid and its role in g-protein-coupled receptor 120 activation in children affected by nonalcoholic fatty liver disease / Della Corte, C., Mosca, A., Ionata, A., Nobili, V
  • Noninvasive prenatal diagnosis of congenital adrenal hyperplasia / Khattab, A., Yuen, T., Sun, L., Yau, M., Barhan, A., Zaidi, M., Lo, Y.M.D., New, M.I
  • Recent advances in hydrocortisone replacement treatment / Mallappa, A., Debono, M
  • Experience with the histrelin implant in pediatric patients / Eugster, E.A
  • Different medications for hypogonadotropic hypogonadism / Rastrelli, G., Vignozzi, L., Maggi, M
  • Long-acting growth hormone : an update / Saenger, P.H., Mejia-Corletto, J
  • C-type natriuretic peptide analog as therapy for achondroplasia / Legeai-Mallet, L
  • Therapeutic neuroendocrine agonist and antagonist analogs of hypothalamic neuropeptides as modulators of the hypothalamic-pituitary-gonadal axis / Newton, C.L., Anderson, R.C., Millar, R.P
  • Aromatase inhibitors in the treatment of short stature / Hero, M
  • Gene therapy for rare central nervous system diseases comes to age / Aubourg, P
  • Novel therapeutic targets and drug candidates for modifying disease progression in adrenoleukodystrophy / Pujol, A.
  • Toward automation of insulin delivery : management solutions for type 1 diabetes / Nimri, R., Phillip, M.
  • Islet transplantation in pediatric patients : current indications and future perspectives / Bertuzzi, F., Antonioli, B., Tosca, M.C., Galuzzi, M., Bonomo, M., Marazzi, M., Colussi, G
  • Glucagon-like peptide-1 receptor agonist treatment for pediatric obesity / Kelly, A.S
  • Docosahexaenoic acid and its role in g-protein-coupled receptor 120 activation in children affected by nonalcoholic fatty liver disease / Della Corte, C., Mosca, A., Ionata, A., Nobili, V
  • Noninvasive prenatal diagnosis of congenital adrenal hyperplasia / Khattab, A., Yuen, T., Sun, L., Yau, M., Barhan, A., Zaidi, M., Lo, Y.M.D., New, M.I
  • Recent advances in hydrocortisone replacement treatment / Mallappa, A., Debono, M
  • Experience with the histrelin implant in pediatric patients / Eugster, E.A
  • Different medications for hypogonadotropic hypogonadism / Rastrelli, G., Vignozzi, L., Maggi, M
  • Long-acting growth hormone : an update / Saenger, P.H., Mejia-Corletto, J
  • C-type natriuretic peptide analog as therapy for achondroplasia / Legeai-Mallet, L
  • Therapeutic neuroendocrine agonist and antagonist analogs of hypothalamic neuropeptides as modulators of the hypothalamic-pituitary-gonadal axis / Newton, C.L., Anderson, R.C., Millar, R.P
  • Aromatase inhibitors in the treatment of short stature / Hero, M
  • Gene therapy for rare central nervous system diseases comes to age / Aubourg, P
  • Novel therapeutic targets and drug candidates for modifying disease progression in adrenoleukodystrophy / Pujol, A.
Medical Library (Lane)
Status of items at Medical Library (Lane)
Medical Library (Lane) Status
Check Lane Library catalog for status
KARGER Unknown
Book
xiii, 412 pages : illustrations, maps ; 26 cm
  • 1. The context-- 2. Origins: social change on the lower Nile-- 3. The Mediterranean frontier: North Africa-- 4. Sudanic genesis: Nubia-- 5. Isolation: the Ethiopian and Eritrean Highlands-- 6. Opportunity and constraint in the West African savanna-- 7. Achieving power: the West African forest and its fringes-- 8. Indian Ocean networks: the East African coast and islands-- 9. Cattle, ivory and gold: social complexity in Zambezia-- 10. Central Africa: the Upemba Depression, Interlacustrine Region and Far West-- 11. Settlement growth and emerging polities: South Africa-- 12. What are the common denominators?
  • (source: Nielsen Book Data)
This new revised edition of African Civilizations re-examines the physical evidence for developing social complexity in Africa over the last six thousand years. Unlike the two previous editions, it is not confined to tropical Africa but considers the whole continent. Graham Connah focuses upon the archaeological research of two key aspects of complexity, urbanism and state formation, in ten main areas of Africa: Egypt, North Africa, Nubia, Ethiopia, the West African savanna, the West African forest, the East African coast and islands, the Zimbabwe Plateau, parts of Central Africa and South Africa. The book's main concern is to review the available evidence in its varied environmental settings, and to consider possible explanations of the developments that gave rise to it. Extensively illustrated, including new maps and plans, and offering an extended list of references, this is essential reading for students of archaeology, anthropology, African history, black studies and social geography.
(source: Nielsen Book Data)
  • 1. The context-- 2. Origins: social change on the lower Nile-- 3. The Mediterranean frontier: North Africa-- 4. Sudanic genesis: Nubia-- 5. Isolation: the Ethiopian and Eritrean Highlands-- 6. Opportunity and constraint in the West African savanna-- 7. Achieving power: the West African forest and its fringes-- 8. Indian Ocean networks: the East African coast and islands-- 9. Cattle, ivory and gold: social complexity in Zambezia-- 10. Central Africa: the Upemba Depression, Interlacustrine Region and Far West-- 11. Settlement growth and emerging polities: South Africa-- 12. What are the common denominators?
  • (source: Nielsen Book Data)
This new revised edition of African Civilizations re-examines the physical evidence for developing social complexity in Africa over the last six thousand years. Unlike the two previous editions, it is not confined to tropical Africa but considers the whole continent. Graham Connah focuses upon the archaeological research of two key aspects of complexity, urbanism and state formation, in ten main areas of Africa: Egypt, North Africa, Nubia, Ethiopia, the West African savanna, the West African forest, the East African coast and islands, the Zimbabwe Plateau, parts of Central Africa and South Africa. The book's main concern is to review the available evidence in its varied environmental settings, and to consider possible explanations of the developments that gave rise to it. Extensively illustrated, including new maps and plans, and offering an extended list of references, this is essential reading for students of archaeology, anthropology, African history, black studies and social geography.
(source: Nielsen Book Data)
Green Library
Status of items at Green Library
Green Library Status
Stacks Find it
DT352.3 .C66 2016 Unknown
Book
1 online resource : illustrations
Building upon his earlier book that detailed agile data warehousing programming techniques for the Scrum master, Ralph's latest work illustrates the agile interpretations of the remaining software engineering disciplines: requirements management benefits from streamlined templates that not only define projects quickly, but ensure nothing essential is overlooked; data engineering receives two new "hyper modeling" techniques, yielding data warehouses that can be easily adapted when requirements change without having to invest in ruinously expensive data-conversion programs; quality assurance advances with not only a stereoscopic top-down and bottom-up planning method, but also the incorporation of the latest in automated test engines. -- Edited summary from book.
Building upon his earlier book that detailed agile data warehousing programming techniques for the Scrum master, Ralph's latest work illustrates the agile interpretations of the remaining software engineering disciplines: requirements management benefits from streamlined templates that not only define projects quickly, but ensure nothing essential is overlooked; data engineering receives two new "hyper modeling" techniques, yielding data warehouses that can be easily adapted when requirements change without having to invest in ruinously expensive data-conversion programs; quality assurance advances with not only a stereoscopic top-down and bottom-up planning method, but also the incorporation of the latest in automated test engines. -- Edited summary from book.
Book
1 online resource