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Cost-driven design of smart microsystems / Michael Niedermayer.

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Author/Creator:
Niedermayer, Michael, 1971-
Language:
English
Imprint:
Boston : Artech House, c2012.
Format:
  • Book
  • xii, 229 p. : ill. ; 24 cm.
Bibliography:
Includes bibliographical references and index.
Contents:
  • Machine generated contents note: 1.Introduction
  • References
  • 2.Design Methodologies
  • 2.1.Design Strategies
  • 2.2.Design of Embedded Systems
  • 2.2.1.Design Strategies for Digital Circuits
  • 2.2.2.Design Strategies for Analog Circuits
  • 2.3.Design of Electronic Components and Microsystems
  • 2.4.Design of Modules with Heterogeneous Components
  • 2.5.Design of Communication Protocols
  • 2.6.Design Models for Smart Microsystems
  • References
  • 3.Fabrication Processes
  • 3.1.Semiconductor Technologies
  • 3.1.1.Wafer Fabrication
  • 3.1.2.Wafer Test
  • 3.1.3.Chip Packaging and Class Test
  • 3.2.Module Integration Technologies
  • 3.2.1.Fabrication of Module Substrates
  • 3.2.2.Assembly and Interconnection
  • 3.2.3.Passivation and Encapsulation Technologies
  • 3.3.Process Modeling
  • References
  • 4.Physical Design Decisions
  • 4.1.Basic Elements of Module Integration
  • 4.1.1.Wiring Capacity of Substrates
  • 4.1.2.Module Systems
  • 4.2.Placement and Routing
  • 4.2.1.Component Arrangement
  • 4.2.2.Component Wiring
  • 4.2.3.Ensuring the Signal Integrity
  • 4.3.Determination of the Miniaturization Potential
  • 4.3.1.Volume Aggregation Lists
  • 4.3.2.Simplified Geometry Models
  • 4.3.3.Adapted Geometry Models
  • References
  • 5.Structural Design Trade-Offs
  • 5.1.Data Processing
  • 5.1.1.Computing Architectures
  • 5.1.2.Implementation of System Functions
  • 5.2.Ambient Interface
  • 5.2.1.Sensor and Actuators
  • 5.2.2.Processing of Sensor Data
  • 5.3.Power Supply
  • 5.3.1.Power Consumption of the Functional Components
  • 5.3.2.Energy Storage and Power Conversion
  • 5.4.Communication Interface
  • 5.4.1.Radio Architectures
  • 5.4.2.Layout of Transmitter and Receiver Circuitry
  • 5.5.Modeling and Simulation of System Architectures
  • 5.5.1.Optimization of Analog Architectural Elements
  • 5.5.2.Optimization of Digital Architectural Elements
  • References
  • 6.Leverage Effects of the Functional Design
  • 6.1.Properties of the Surrounding Medium
  • 6.1.1.Concentrated and Distributed Phenomena
  • 6.1.2.Signal Propagation
  • 6.1.3.Interferences
  • 6.1.4.Modeling of Environmental Influences
  • 6.2.Radio Communications
  • 6.2.1.Modulation Schemes
  • 6.2.2.Media Access Schemes
  • 6.2.3.Logical Link Control
  • 6.2.4.Network Control
  • 6.3.Distributed Data Acquisition
  • 6.3.1.Localization
  • 6.3.2.Synchronization and Calibration
  • 6.4.Determination of Functional Optimization Potential
  • 6.4.1.Aggregation Lists of System Parameters
  • 6.4.2.Simplified System Models
  • 6.4.3.Adapted System Models
  • References
  • 7.Cost Fundamentals
  • 7.1.Basic Cost Categories
  • 7.2.Approaches of Cost Estimation
  • 7.2.1.Cost Determination of Fabrication Processes
  • 7.2.2.Cost Determination of System Components
  • 7.3.Direct Component Costs
  • 7.3.1.Determination of Cost-Driving Function Components
  • 7.3.2.Determination of Costs for Module Integration
  • 7.4.Indirect Costs of Product Development
  • 7.4.1.Development Effort of Hardware
  • 7.4.2.Development Effort of Software
  • 7.4.3.Generalized Cost Modeling of Development Activities
  • 7.4.4.Influence of Expectations
  • References
  • 8.Cost Reduction Strategies
  • 8.1.Model-Based Cost Optimization
  • 8.1.1.Determination of Potential Cost Reduction
  • 8.1.2.Design Flow
  • 8.2.Smart Microsystems with Tailored Architectures
  • 8.3.Smart Microsystems with Universal Architectures
  • 8.4.Smart Microsystems with Modular Architectures
  • References
  • 9.Application Examples
  • 9.1.Smart Microsystems for Tracking Transport Goods
  • 9.1.1.Functional Design Decisions
  • 9.1.2.Physical Design Decisions
  • 9.2.Smart Microsystems for Condition Monitoring
  • 9.2.1.Functional Design Decisions
  • 9.2.2.Physical Design Decisions.
Series:
Artech House integrated microsystems series.
Subjects:
ISBN:
9781608070848
1608070840

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